公开(公告)号：US06851432B2

公开(公告)日：2005-02-08

申请号：US10414898

申请日：2003-04-16

申请人： Shahriar Naghshineh ,  Yassaman Hashemi

发明人： Shahriar Naghshineh ,  Yassaman Hashemi

IPC分类号： C11D7/60 ,  C11D3/00 ,  C11D3/02 ,  C11D3/20 ,  C11D3/24 ,  C11D3/26 ,  C11D3/30 ,  C11D7/02 ,  C11D7/26 ,  C11D7/28 ,  C11D7/32 ,  C11D11/00 ,  C11D17/08 ,  C23G1/20 ,  H01L21/304 ,  H01L21/306 ,  H01L21/311 ,  H01L21/3213 ,  B08B3/04

CPC分类号： H01L21/31138 ,  C11D3/0073 ,  C11D3/042 ,  C11D3/046 ,  C11D3/2086 ,  C11D3/245 ,  C11D3/30 ,  C11D11/0047 ,  C11D11/007 ,  C23G1/20 ,  H01L21/02052 ,  H01L21/02071 ,  H01L21/31116

摘要： An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.

摘要翻译： 一种含水清洁组合物，其包含链烷醇胺，氢氧化四烷基铵，非金属氟化物盐，腐蚀抑制剂， 抗坏血酸或其衍生物单独或组合，平衡水。 这种清洁组合物有效地从低等温度下与等离子体处理产生的有机，金属 - 有机材料，无机盐，氧化物，氢氧化物或络合物结合或排除有机光致抗蚀剂薄膜，几乎不腐蚀铜和电介质基底的侵蚀。

公开(公告)号：US06627587B2

公开(公告)日：2003-09-30

申请号：US09839475

申请日：2001-04-19

申请人： Shahriar Naghshineh ,  Yassaman Hashemi

发明人： Shahriar Naghshineh ,  Yassaman Hashemi

IPC分类号： C11D166

CPC分类号： H01L21/31138 ,  C11D3/0073 ,  C11D3/042 ,  C11D3/046 ,  C11D3/2086 ,  C11D3/245 ,  C11D3/30 ,  C11D11/0047 ,  C11D11/007 ,  C23G1/20 ,  H01L21/02052 ,  H01L21/02071 ,  H01L21/31116

摘要： An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.

公开(公告)号：US06194366B1

公开(公告)日：2001-02-27

申请号：US09440917

申请日：1999-11-16

申请人： Shahriar Naghshineh ,  Jeff Barnes ,  Yassaman Hashemi ,  Ewa B. Oldak

发明人： Shahriar Naghshineh ,  Jeff Barnes ,  Yassaman Hashemi ,  Ewa B. Oldak

IPC分类号： C11D726

CPC分类号： C11D11/0047 ,  C11D1/62 ,  C11D3/0073 ,  C11D3/2058 ,  C11D3/2065 ,  C11D3/2072 ,  C11D3/2086 ,  C11D3/28 ,  C11D3/30 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3218 ,  C11D7/3245 ,  G03F7/425

摘要： A cleaning solution is provided for cleaning copper-containing microelectronic substrates, particularly for post-CMP or Via formation cleaning. The cleaning solution comprises a quaternary ammonium hydroxide, an organic amine, a corrosion inhibitor, and water. A preferred cleaning solution comprises tetramethylammonium hydroxide, monoethanolamine, gallic acid, and water. The pH of the cleaning solution is greater than 10.

摘要翻译： 提供清洁溶液用于清洗含铜微电子基板，特别是用于后CMP或Via地层清洗。 清洗溶液包含季铵氢氧化物，有机胺，腐蚀抑制剂和水。 优选的清洁溶液包括四甲基氢氧化铵，单乙醇胺，没食子酸和水。 清洗液的pH值大于10。