公开(公告)号：US06767643B2

公开(公告)日：2004-07-27

申请号：US09931406

申请日：2001-08-17

Applicant: Hifumi Nagai ,  Junji Miyake ,  Yasuo Tomioka

Inventor： Hifumi Nagai ,  Junji Miyake ,  Yasuo Tomioka

IPC: B32B1508

CPC classification number: C22C9/00 ,  B32B15/08 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/385 ,  H05K2201/0141 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T428/265 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: A copper-alloy foil used for a laminate sheet achieves 5.0N/cm or more of 180° peeling strength when thermally fusion-bonded with liquid crystal polymer. The copper-alloy foil contains one or more of from 0.01 to 2.0% of Cr and from 0.01 to 1.0% of Zr. An oxide layer and occasionally a rust-proof film present on the outermost surface is 10 nm or less. The electrical conductivity is 50% IACS.

Abstract translation: 与液晶聚合物热熔接时，用于层压片的铜合金箔的剥离强度达到了5.0N / cm以上。 铜合金箔含有0.01〜2.0％的Cr和0.01〜1.0％的Zr中的一种或多种。 存在于最外表面的氧化物层和偶有防锈膜为10nm以下。 电导率为50％IACS。

公开(公告)号：US20080277032A1

公开(公告)日：2008-11-13

申请号：US12134043

申请日：2008-06-05

Applicant: Yasuo TOMIOKA ,  Junji Miyake

Inventor： Yasuo TOMIOKA ,  Junji Miyake

IPC: C22C9/06 ,  C22C9/00

CPC classification number: B21B3/00 ,  B21B2003/005 ,  C22F1/08

Abstract: Copper and copper alloy comprises: a structure having fine crystal grains with grain size of 1 μm or less after a final cold rolling with a reduction η, wherein η is expressed in the following formula and satisfying η≧3; and an elongation of 2% or more in a tensile test. η=ln(T0/T1) T0: plate thickness before rolling, T1: plate thickness after rolling.

Abstract translation: 铜和铜合金包括：在具有还原η的最终冷轧后具有晶粒尺寸为1μm或更小的细晶粒的结构，其中eta以下式表达并满足eta> = 3; 拉伸试验中伸长率为2％以上。 <？in-line-formula description =“In-line Formulas”end =“lead”？> eta = ln（T / T 1 < line-formula description =“In-line Formulas”end =“tail”？> T 0 ：轧制前的板厚度，T <1：轧制后的板厚度。

公开(公告)号：US06602362B2

公开(公告)日：2003-08-05

申请号：US09805160

申请日：2001-03-14

Applicant: Yasuo Tomioka ,  Tetsuo Maki ,  Naohiko Era

Inventor： Yasuo Tomioka ,  Tetsuo Maki ,  Naohiko Era

IPC: C22C906

CPC classification number: G11B5/4833 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2203/0278

Abstract: Conductors, which are formed on a suspension member of the hard-disc drive suspension, are subject to thermal expansion and shrinkage during the laminating process with a substrate via a polyimide binder. The tracking width of the suspension member is influenced by the thermal expansion and shrinkage. In order to provide a copper-alloy foil, which can attain improved tracking width, the following ratio of thermal expansion and shrinkage is adjusted in a range of from −0.1 to +0.1% &Dgr;(%)=(l−l0)/l0×100 where l0 the length of a specimen before heating at 330° C. for 2 hours, and l is the length of a specimen after heating at 330° C. for 2 hours. &Dgr;(%) is measured in the direction parallel to the rolling direction.

Abstract translation: 形成在硬盘驱动悬架的悬挂构件上的导体在与基板通过聚酰亚胺粘合剂层压工艺期间经受热膨胀和收缩。 悬挂构件的跟踪宽度受热膨胀和收缩的影响。 为了提供能够获得改善的跟踪宽度的铜合金箔，将以下热膨胀和收缩率调节在-0.1至+ 0.1％的范围内，其中在330℃下加热之前的样品的长度 C.2小时，l是在330℃下加热2小时后的样品的长度。 在平行于轧制方向的方向上测量ΔTA（％）。

公开(公告)号：US6093499A

公开(公告)日：2000-07-25

申请号：US285853

申请日：1999-04-02

Applicant: Yasuo Tomioka

Inventor： Yasuo Tomioka

IPC: C22C9/00 ,  C22C9/04 ,  H05K1/09 ,  B21C37/02

CPC classification number: C22C9/04 ,  C22C9/00 ,  H05K1/09 ,  H05K2201/0355 ,  Y10S360/90 ,  Y10T428/12 ,  Y10T428/12431 ,  Y10T428/12438

Abstract: Copper alloy foils are provided having far greater strength and heat resistance than conventional copper foils, and having better productivity, are characterized by a composition comprising, all by weight, from 0.01 to 0.4% Cr, from 0.01 to 0.25% Zr, from 0.02 to 2.0% Zn; and when necessary from 0.05 to 1.8% Fe and from 0.05 to 0.8% Ti; and when further necessary one or more elements selected from the group consisting of Ni, Sn, In, Mn, P, Mg, Al, B, As, Cd, Co, Te, Ag, and Hf in a total amount of from 0.005 to 1.5%; the balance being copper and unavoidable impurities. Inclusions in the copper foil not larger than 10 .mu.m in size, and the inclusions between 0.5 and 10 .mu.m in size number less than 100 pieces/mm.sup.2.

Abstract translation: 提供的铜合金箔的强度和耐热性比常规铜箔具有更高的生产率，其特征在于组合物包括：0.01-0.4％的Cr，0.01-0.25％的Zr，0.02- 2.0％Zn; 并且当需要0.05至1.8％的Fe和0.05至0.8％的Ti时; 并且当进一步需要一种或多种选自Ni，Sn，In，Mn，P，Mg，Al，B，As，Cd，Co，Te，Ag和Hf的元素，其总量为0.005〜 1.5％; 余量为铜和不可避免的杂质。 铜箔中的夹杂物尺寸不大于10微米，夹杂物在0.5-10μm之间，尺寸小于100个/ mm2。