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1.发明申请RIGID-FLEXIBLE PRINTED CIRCUIT BOARD HAVING A PEELABLE MASK AND METHOD OF MAKING 有权具有可剥离面罩的刚性柔性印刷电路板及其制造方法公开(公告)号：US20090321112A1
公开(公告)日：2009-12-31
申请号：US12164799
申请日：2008-06-30
Applicant: Yen Ching Chiang , Shih Chia Fang , Jun Yi Wang , Hsiu Lin Huang
Inventor： Yen Ching Chiang , Shih Chia Fang , Jun Yi Wang , Hsiu Lin Huang
CPC classification number: H05K3/4691 , H05K1/118 , H05K3/288 , H05K2201/0162 , H05K2201/099 , H05K2203/0264 , H05K2203/0759 , H05K2203/308 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.
Abstract translation: 本发明涉及一种制造柔性刚性PCB的方法，其包括柔性电路基板和刚性电路基板。 柔性电路衬底限定刚性区域和暴露区域，并且具有形成在暴露区域上的导电图案，例如导电迹线。 该方法包括提供柔性电路基板的步骤; 将含有环氧 - 硅氧烷杂化材料的糊料印刷到导电图案上; 固化糊状物 以及在柔性电路基板的刚性区域上建立刚性电路基板。 特别地，具有特定组成的糊料经受预定的温度和时间条件，以便将该糊料转变成具有耐热性，耐化学性和接触角大于20度的可剥离掩模。
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2.发明授权Method of making rigid-flexible printed circuit board having a peelable mask 有权制造具有可剥离掩模的刚性柔性印刷电路板的方法公开(公告)号：US08033013B2
公开(公告)日：2011-10-11
申请号：US12164799
申请日：2008-06-30
Applicant: Yen Ching Chiang , Shih Chia Fang , Jun Yi Wang , Hsiu Lin Huang
Inventor： Yen Ching Chiang , Shih Chia Fang , Jun Yi Wang , Hsiu Lin Huang
CPC classification number: H05K3/4691 , H05K1/118 , H05K3/288 , H05K2201/0162 , H05K2201/099 , H05K2203/0264 , H05K2203/0759 , H05K2203/308 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.
Abstract translation: 本发明涉及一种制造柔性刚性PCB的方法，其包括柔性电路基板和刚性电路基板。 柔性电路衬底限定刚性区域和暴露区域，并且具有形成在暴露区域上的导电图案，例如导电迹线。 该方法包括提供柔性电路基板的步骤; 将含有环氧 - 硅氧烷杂化材料的糊料印刷到导电图案上; 固化糊状物 以及在柔性电路基板的刚性区域上建立刚性电路基板。 特别地，具有特定组成的糊料经受预定的温度和时间条件，以便将该糊料转变成具有耐热性，耐化学性和接触角大于20度的可剥离掩模。
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