Abstract:
Provided are methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby. The device may include electrodes sequentially stacked on a substrate to constitute an electrode structure. each of the electrodes may include a connection portion protruding horizontally and outward from a sidewall of one of the electrodes located thereon and an aligned portion having a sidewall coplanar with that of one of the electrodes located thereon or thereunder. Here, at least two of the electrodes provided vertically adjacent to each other may be provided in such a way that the aligned portions thereof have sidewalls that are substantially aligned to be coplanar with each other.
Abstract:
A semiconductor device includes a substrate extending in a horizontal direction. An active pillar is present on the substrate extending in a vertical direction relative to the horizontal direction of extension of the substrate. A variable resistive pattern is present on the substrate extending in the vertical direction along the active pillar, an electrical resistance of the variable resistive pattern being variable in response to an oxidation or reduction thereof. A gate is present at a sidewall of the active pillar.
Abstract:
Provided are methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby. The device may include electrodes sequentially stacked on a substrate to constitute an electrode structure. each of the electrodes may include a connection portion protruding horizontally and outward from a sidewall of one of the electrodes located thereon and an aligned portion having a sidewall coplanar with that of one of the electrodes located thereon or thereunder. Here, at least two of the electrodes provided vertically adjacent to each other may be provided in such a way that the aligned portions thereof have sidewalls that are substantially aligned to be coplanar with each other.
Abstract:
Variable resistance memory devices and methods of forming the same are disclosed. The devices may include an additional barrier layer that is a portion of a variable resistance layer and that is formed before forming a horizontal electrode layer. Due to the presence of the additional barrier layer, it may be possible to cure loss or damage of the variable resistance layer.
Abstract:
A nonvolatile memory device includes a word line group including a plurality of middle word lines and an edge word line having charge storage patterns on a substrate. A peripheral line is disposed on one side of the word line group so that the edge word line is between the peripheral word line and the middle word lines. The peripheral line includes an insulating layer and a gate electrode. Charge storage patterns of the middle and edge word lines are separated from each other, and a charge storage pattern of the edge word line extends on one side to be connected to the insulating layer of the peripheral line. Methods of forming nonvolatile memory devices are also disclosed.
Abstract:
A semiconductor device includes a substrate, a stack, and channel structures penetrating the stack. The stack includes gate electrodes and insulating layers alternately and repeatedly stacked on the substrate, and extending in a first direction. The channel structures in a first row are spaced apart from each other in the first direction. The stack includes a first sidewall that includes first recessed portions and first protruding portions. Each of first recessed portions is defined by an adjacent pair of the first recessed portions. Each of the first recessed portions has a shape recessed toward a first region of the stack between an adjacent pair of the channel structures of the first row. Each of the first recessed portions has a width that decreases in a direction toward the first region when measured along the first direction.
Abstract:
Variable resistance memory devices and methods of forming the same are disclosed. The devices may include an additional barrier layer that is a portion of a variable resistance layer and that is formed before forming a horizontal electrode layer. Due to the presence of the additional barrier layer, it may be possible to cure loss or damage of the variable resistance layer.
Abstract:
Variable resistance memory devices and methods of forming the same are disclosed. The devices may include an additional barrier layer that is a portion of a variable resistance layer and that is formed before forming a horizontal electrode layer. Due to the presence of the additional barrier layer, it may be possible to cure loss or damage of the variable resistance layer.
Abstract:
A charge trap flash memory device includes a flash memory array having at least a first page of charge trap memory cells therein electrically coupled to a first word line. The first page of charge trap memory cells includes a plurality of addressable memory cells configured to store data to be retrieved during read operations and a plurality of immediately adjacent non-addressable “dummy” memory cells configured to store dummy data that is not retrievable during the read operations. The plurality of dummy memory cells include at least one auxiliary dummy memory cell that operates as a buffer against lateral hole transfer within a charge trap layer of the array.
Abstract:
A charge trap flash memory device includes a flash memory array having at least a first page of charge trap memory cells therein electrically coupled to a first word line. The first page of charge trap memory cells includes a plurality of addressable memory cells configured to store data to be retrieved during read operations and a plurality of immediately adjacent non-addressable “dummy” memory cells configured to store dummy data that is not retrievable during the read operations. The plurality of dummy memory cells include at least one auxiliary dummy memory cell that operates as a buffer against lateral hole transfer within a charge trap layer of the array.