摘要:
In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.
摘要:
An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.
摘要:
An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.
摘要:
A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要:
A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.
摘要:
An air-cooled information processing apparatus has a plurality of units and a casing accommodating the units. At least one cooling air supply section and at least one cooling air discharge section are provided in the casing, for supplying cooling air into the apparatus and for discharging the air therefrom. A partition member divides the space inside the casing so as to define at least two cooling air flow channels between the cooling air supply section and the cooling air discharge section. At least one main fan unit is disposed in each of the cooling air flow channels. The cooling air flow channels include at least one first cooling air flow channel in which at least two units from among the plurality of units are disposed in parallel with each other with respect to the direction of flow of cooling air, and at least one second cooling air flow channel in which at least two units from among the plurality of units are arranged in series to each other along the flow of cooling air. This cooling arrangement ensures optimum cooling for different types of units in the apparatus, without being accompanied by rise in the noise level, rate of discharge of air, power consumption and production cost.
摘要:
A load on the shins when a knee airbag is deployed by inflating in a state in which the knees of an occupant are proximate to an airbag door or suchlike is moderated. Inside a knee airbag, an upper tether and a lower tether are disposed to sandwich an inflator from above and below. First opening portions and second opening portions for letting gas flow through up and down are alternatingly formed in the upper tether and the lower tether. The second opening portions are formed as circular holes with smaller diameters than the first opening portions. The second opening portions are disposed at positions opposing the knees of a small occupant in a sitting state.
摘要:
An air bag door is developed quickly even if the clearance between the grab door outer and the knee of a crew or passenger is narrow when a tier type air bag door is employed in a knee air bag device for vehicle. A fracture portion (50) consisting of a lateral fracture portion (50A) and longitudinal fracture portions (50B, 50C) is formed in the grab door outer general portion (24A). Thus, an air bag door (52) consisting of total six doors, i.e. an upper central air bag door (52A), an upper left side air bag door (52B), an upper right side air bag door (52C), a lower central air bag door (52D), a lower left side air bag door (52E), and a lower right side air bag door (52F), is formed. Even if both knees of the crewman or passenger of a small-sized build are arranged in proximity to or in contact with the lower left side air bag door (52E) and the lower right side air bag door (52F), the lower central air bag door (52D) opens smoothly between both the knees in addition to the upper side air bag doors in the initial stage of development of the air bag door (52).
摘要:
In a knee airbag device for a vehicle, which has upper and lower tethers that extend in a vehicle width direction and regulate a bag thickness of an airbag, and in which gas from an inflator is supplied between the upper and lower tethers, it is aimed to make a flow of the gas toward an upper portion and a lower portion from between the upper and lower tethers at the inside of the knee airbag smoother, and to improve deployability of the knee airbag in a vehicle vertical direction.Upper and lower tethers 16 and 18 are arranged to be separated from each other in the vehicle vertical direction and are formed so that a vertical clearance therebetween increases approaching both vehicle width direction end portions 16A and 18A thereof. When the gas is supplied between the upper and lower tethers 16 and 18, the gas spreads to both vehicle width direction sides along the tethers 16 and 18 and smoothly moves around into an upper portion 14A and a lower portion 14B of a knee airbag 14 from both of the end portions 16A and 18A of the tethers 16 and 18.
摘要:
An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.