公开(公告)号：US5361188A

公开(公告)日：1994-11-01

申请号：US115669

申请日：1993-09-02

申请人： Yoshihiro Kondou ,  Hitoshi Matsushima ,  Toshio Hatada ,  Hiroshi Inouye ,  Toshihiro Komatsu ,  Takao Ohba ,  Akira Yamagiwa

发明人： Yoshihiro Kondou ,  Hitoshi Matsushima ,  Toshio Hatada ,  Hiroshi Inouye ,  Toshihiro Komatsu ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20 ,  H01L23/467

CPC分类号： H01L23/467 ,  H05K7/20563 ,  H01L2224/32 ,  H01L2224/73253 ,  Y10S165/908

摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.

摘要翻译： 在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。 具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。 导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。 这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。 这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。

公开(公告)号：US5195576A

公开(公告)日：1993-03-23

申请号：US659671

申请日：1991-02-25

申请人： Toshio Hatada ,  Hitoshi Matsushima ,  Yoshihiro Kondou ,  Hiroshi Inoue ,  Kanji Otsuka ,  Yuji Shirai ,  Takao Ohba ,  Akira Yamagiwa

发明人： Toshio Hatada ,  Hitoshi Matsushima ,  Yoshihiro Kondou ,  Hiroshi Inoue ,  Kanji Otsuka ,  Yuji Shirai ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H01L23/473 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  H05K7/10 ,  H05K7/20

CPC分类号： F28F3/022 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/467 ,  H05K7/1015 ,  H01L2224/45015 ,  H01L2224/49109 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/16195

摘要： An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.

摘要翻译： 具有各种结构的LSI冷却装置用于诸如计算机系统的电子设备中。 特别地，装置的LSI冷却适用于具有高发热密度的LSI的冷却。 在本发明的冷却装置中，散热器的压力损失小，冷却性能优异。 这是因为散热器包括细线散热片，使得雷诺数不得超过40个。结果，可以冷却产生大量热量的LSI。 此外，通过将宽幅拉丝物质设置在细线中或通过使用支撑体，可以获得具有刚性的散热器。 此外，包括散热器的LSI的计算机可以应对各种冷却空气送出方法，并且可以以低噪声进行冷却。

公开(公告)号：US5428503A

公开(公告)日：1995-06-27

申请号：US317614

申请日：1994-09-26

申请人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

发明人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20

CPC分类号： H05K7/20154 ,  Y10S165/908

摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

摘要翻译： 一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性 电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。 冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。 喷射冷却装置与印刷电路板平行地形成。 喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。 因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。 因此，能够使发热元件的温度上升均匀。

公开(公告)号：US5504924A

公开(公告)日：1996-04-02

申请号：US317621

申请日：1994-09-26

申请人： Shingeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Toshio Hatada ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa

发明人： Shingeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Toshio Hatada ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： G06F1/00 ,  F28D15/02 ,  G06F1/20 ,  H05K7/20 ,  G06F9/00

CPC分类号： H05K7/208 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  G06F1/206 ,  H05K7/20809 ,  G06F2200/201

摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.

摘要翻译： 一种电子计算机冷却系统，其具有用于冷却电子计算机的冷却装置和用于热连接半导体装置的冷却构件，所述冷却构件的工作速度通过冷却而升高到所述冷却装置的低温源。 安装构成电子计算机的半导体装置等的电路板被紧凑地封闭在一个壳体中，诸如制冷装置等的冷却装置。 或者，电路板和冷却装置分别紧密地封闭在分离的可拆卸的外壳中。 因此，可以获得通过使用冷却部件可靠地冷却期望的半导体器件的结构。

公开(公告)号：US5365402A

公开(公告)日：1994-11-15

申请号：US800268

申请日：1991-11-29

申请人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

发明人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2224/32188 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

摘要翻译： 一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。 弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

公开(公告)号：US5315482A

公开(公告)日：1994-05-24

申请号：US961394

申请日：1992-10-15

申请人： Akira Tanaka ,  Hiroichi Shinohara ,  Kazuji Yamada ,  Takao Ohba ,  Akira Yamagiwa ,  Hitoshi Yoshidome ,  Yuji Shirai ,  Toshio Hatada ,  Munehisa Kishimoto ,  Michiharu Honda

发明人： Akira Tanaka ,  Hiroichi Shinohara ,  Kazuji Yamada ,  Takao Ohba ,  Akira Yamagiwa ,  Hitoshi Yoshidome ,  Yuji Shirai ,  Toshio Hatada ,  Munehisa Kishimoto ,  Michiharu Honda

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L25/10 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K7/20

CPC分类号： H05K1/021 ,  H01L23/367 ,  H01L25/105 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/182 ,  H05K2203/049 ,  H05K3/0061 ,  H05K3/366

摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

摘要翻译： 半导体装置包括热扩散板和表面安装印刷板。 在散热板上安装有高发热的半导体装置。 表面安装封装和芯片部件安装在印刷电路板的两个表面上。 在印刷电路板的中心形成通孔，使得半导体器件位于中心。 已经安装了半导体器件的散热板和表面安装印刷板连接并整合。

公开(公告)号：US07911224B2

公开(公告)日：2011-03-22

申请号：US12116541

申请日：2008-05-07

申请人： Toshitsugu Takekuma ,  Ryoichi Kurihara ,  Akira Yamagiwa

发明人： Toshitsugu Takekuma ,  Ryoichi Kurihara ,  Akira Yamagiwa

IPC分类号： H03K19/003

CPC分类号： H04L25/0298 ,  G06F13/4072 ,  G06F13/4086 ,  H04B3/02 ,  H04L25/0278 ,  H04L25/028 ,  H04L25/0292 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/14

摘要： A signal transmitting circuit includes a circuit block having a driving circuit and an intra-block transmission line for transmitting a signal from the driving circuit, a circuit block having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between the driving and receiving circuit blocks. The inter-block transmission line is terminated by a resistor having substantially the same impedance as the interblock transmission line. The intra-block transmission lines are provided with a resistance element having a resistance substantially equal to a value derived by subtracting half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.

摘要翻译： 信号发送电路包括具有用于发送来自驱动电路的信号的驱动电路和块内传输线路的电路块，具有接收电路的电路块和用于将信号发送到所述接收电路的块内传输线路 以及用于在驱动和接收电路块之间传播信号的主块间传输线。 块间​​传输线由具有与块间传输线基本上相同阻抗的电阻端接。 块内传输线路设置有电阻元件，其电阻基本上等于通过将块间传输线路的阻抗的一半从块内传输线路的阻抗减去一半到更低的信号幅度， 抑制沿着主块间传输线的分支点处的信号的反射，从而实现高速信号传送。

公开(公告)号：US07123048B2

公开(公告)日：2006-10-17

申请号：US11049663

申请日：2005-02-04

申请人： Toshitsuqu Takekuma ,  Ryoichi Kurihara ,  Akira Yamagiwa

发明人： Toshitsuqu Takekuma ,  Ryoichi Kurihara ,  Akira Yamagiwa

IPC分类号： H03K17/16

CPC分类号： H04L25/0298 ,  G06F13/4072 ,  G06F13/4086 ,  H04B3/02 ,  H04L25/0278 ,  H04L25/028 ,  H04L25/0292 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/14

摘要： A signal transmitting circuit includes a circuit block having a driving circuit and an intra-block transmission line for transmitting a signal from the driving circuit, a circuit block having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between the driving and receiving circuit blocks. The inter-block transmission line is terminated by a resistor having substantially the same impedance as the interblock transmission line. The intra-block transmission lines are provided with a resistance element having a resistance substantially equal to a value derived by subtracting half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.

公开(公告)号：US20050088200A1

公开(公告)日：2005-04-28

申请号：US10989279

申请日：2004-11-17

申请人： Toshitsugu Takekuma ,  Ryoichi Kurihara ,  Akira Yamagiwa

发明人： Toshitsugu Takekuma ,  Ryoichi Kurihara ,  Akira Yamagiwa

IPC分类号： G06F3/00 ,  G06F12/00 ,  G06F13/16 ,  G06F13/40 ,  G11C11/401 ,  H03K19/0175 ,  H04B3/02 ,  H04L25/02 ,  H05K1/02 ,  H05K1/14 ,  H03K19/003

CPC分类号： H04L25/0298 ,  G06F13/4072 ,  G06F13/4086 ,  H04B3/02 ,  H04L25/0278 ,  H04L25/028 ,  H04L25/0292 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/14

摘要： A signal transmitting circuit includes a circuit block having a driving circuit and an intra-block transmission line for transmitting a signal from the driving circuit, a circuit block having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between the driving and receiving circuit blocks. The inter-block transmission line is terminated by a resistor having substantially the same impedance as the interblock transmission line. The intra-block transmission lines are provided with a resistance element having a resistance substantially equal to a value derived by subtracting half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.

公开(公告)号：US06780677B2

公开(公告)日：2004-08-24

申请号：US10224339

申请日：2002-08-21

申请人： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

发明人： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC分类号： H01L2144

CPC分类号： H05K1/111 ,  H01L21/563 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/00

摘要： An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.