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公开(公告)号:US20110038065A1
公开(公告)日:2011-02-17
申请号:US12988185
申请日:2009-04-16
申请人: Yoshihiro Miyawaki , Yuji Muraoka , Nobuyuki Ando , Junichi Nakamura , Yasunori Tsujino , Masafumi Yamashita , Yukihiro Kasano
发明人: Yoshihiro Miyawaki , Yuji Muraoka , Nobuyuki Ando , Junichi Nakamura , Yasunori Tsujino , Masafumi Yamashita , Yukihiro Kasano
CPC分类号: G02B7/021 , G02B7/022 , G02B13/0035 , G02B13/006
摘要: The present invention provides an imaging lens unit configured to be processed by the solder reflow process, can be miniaturized, and has sufficient thermal resistance for the reflow temperatures. The imaging lens unit also provides excellent optical characteristics such as transmissivity, a refractive index, and the like without deteriorating the optical characteristics in alignment of the centers of the lens and the diaphragm even after the reflow process, so as to contribute to reduction in the size and an increase in the capabilities. The imaging lens unit is configured to be processed by a solder reflow process, and includes a lens group consisting of one or more lenses; and a lens tube that supports the lens group, wherein the imaging lens unit comprises one or more cationically-cured epoxy resin lenses formed from an cationically-curable epoxy resin material, the lens tube is formed from a thermoplastic resin material having a deflection temperature under load of not lower than 200° C., and the imaging lens unit has a clearance between the lens tube and at least one of the cationically-cured epoxy resin lenses and has lens supporting portions that are provided at at least three locations inside the lens tube and that support the at least one cationically-cured epoxy resin lens.
摘要翻译: 本发明提供一种被配置为通过回流焊工艺处理的成像透镜单元,可以小型化,并且对于回流温度具有足够的热阻。 即使在回流处理之后,成像透镜单元也提供优异的光学特性,例如透射率,折射率等,而不会降低透镜和隔膜的中心对准的光学特性,从而有助于减少 尺寸和功能的增加。 成像透镜单元被配置为通过焊料回流处理进行处理,并且包括由一个或多个透镜组成的透镜组; 以及支撑所述透镜组的透镜管,其中所述成像透镜单元包括由阳离子可固化环氧树脂材料形成的一个或多个阳离子固化的环氧树脂透镜,所述透镜管由具有挠曲温度的热塑性树脂材料形成 并且成像透镜单元在透镜管与至少一个阳离子固化环氧树脂透镜之间具有间隙,并且具有设置在透镜内的至少三个位置处的透镜支撑部分 并且其支撑至少一种阳离子固化的环氧树脂透镜。
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公开(公告)号:US20050104685A1
公开(公告)日:2005-05-19
申请号:US10962170
申请日:2004-10-07
CPC分类号: H04B1/0057 , H01L23/66 , H01L24/73 , H01L25/16 , H01L2223/6677 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H03H9/725 , H04B1/52 , H05K1/0237 , H05K1/0298 , H05K1/16 , H01L2924/00012 , H01L2924/00
摘要: A high-frequency module has a structure wherein transmitting filters, receiving filters and high-frequency power amplifiers are mounted on a multilayered substrate and wherein matching circuits are inserted between input terminals of the receiving filters and output terminals of the transmitting filters. Transmission lines as components of the matching circuits, and the like are formed internally of the multilayered substrate. Thus, the whole body of the high-frequency module can be downsized.
摘要翻译: 高频模块具有其中发送滤波器,接收滤波器和高频功率放大器安装在多层基板上的结构,并且其中匹配电路插入在接收滤波器的输入端子和发射滤波器的输出端子之间。 作为匹配电路的部件的传输线等在多层基板的内部形成。 因此,高频模块的整体可以被小型化。
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公开(公告)号:US07289008B2
公开(公告)日:2007-10-30
申请号:US10962170
申请日:2004-10-07
CPC分类号: H04B1/0057 , H01L23/66 , H01L24/73 , H01L25/16 , H01L2223/6677 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H03H9/725 , H04B1/52 , H05K1/0237 , H05K1/0298 , H05K1/16 , H01L2924/00012 , H01L2924/00
摘要: A high-frequency module has a structure wherein transmitting filters, receiving filters and high-frequency power amplifiers are mounted on a multilayered substrate and wherein matching circuits are inserted between input terminals of the receiving filters and output terminals of the transmitting filters. Transmission lines as components of the matching circuits, and the like are formed internally of the multilayered substrate. Thus, the whole body of the high-frequency module can be downsized.
摘要翻译: 高频模块具有其中发送滤波器,接收滤波器和高频功率放大器安装在多层基板上的结构,并且其中匹配电路插入在接收滤波器的输入端子和发射滤波器的输出端子之间。 作为匹配电路的部件的传输线等在多层基板的内部形成。 因此,高频模块的整体可以被小型化。
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公开(公告)号:US08270103B2
公开(公告)日:2012-09-18
申请号:US12988185
申请日:2009-04-16
申请人: Yoshihiro Miyawaki , Yuji Muraoka , Nobuyuki Ando , Junichi Nakamura , Yasunori Tsujino , Masafumi Yamashita , Yukihiro Kasano
发明人: Yoshihiro Miyawaki , Yuji Muraoka , Nobuyuki Ando , Junichi Nakamura , Yasunori Tsujino , Masafumi Yamashita , Yukihiro Kasano
IPC分类号: G02B7/02
CPC分类号: G02B7/021 , G02B7/022 , G02B13/0035 , G02B13/006
摘要: An imaging lens unit configured for processing by a solder reflow process, and includes a lens group of one or more lenses; and a lens tube supporting the lens group. The imaging lens unit comprises one or more cationically-cured epoxy resin lenses formed from an cationically-curable epoxy resin material, the lens tube is formed from a thermoplastic resin material having a deflection temperature under load of at least 200° C. The imaging lens unit has a clearance between the lens tube and at least one of the cationically-cured epoxy resin lenses and has lens supporting portions provided at least three locations inside the lens tube that support the at least one cationically-cured epoxy resin lens. The lens unit can be miniaturized. The imaging lens unit also provides excellent optical characteristics without deteriorating the optical characteristics in alignment of the centers of the lens and the diaphragm.
摘要翻译: 一种成像透镜单元,被配置为通过焊料回流处理进行处理,并且包括一个或多个透镜的透镜组; 以及支撑透镜组的透镜管。 成像透镜单元包括由阳离子可固化环氧树脂材料形成的一种或多种阳离子固化的环氧树脂透镜,透镜管由具有至少200℃负载挠曲温度的热塑性树脂材料形成。成像透镜 单元在透镜管与至少一个阳离子固化环氧树脂透镜之间具有间隙,并且具有透镜支撑部分,其设置在透镜管内部的至少三个位置,其支撑至少一个阳离子固化的环氧树脂透镜。 透镜单元可以小型化。 成像透镜单元还提供优异的光学特性,而不会降低透镜和隔膜的中心对准的光学特性。
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