公开(公告)号：US6113053A

公开(公告)日：2000-09-05

申请号：US111860

申请日：1998-07-08

申请人： Yoshimitsu Kumagai ,  Fumihiko Hikita

发明人： Yoshimitsu Kumagai ,  Fumihiko Hikita

IPC分类号： G01R1/04 ,  G01R31/28 ,  H01R12/36 ,  H05K3/22 ,  H05K13/04 ,  B65D63/00 ,  A47F1/10 ,  H02G3/08

CPC分类号： G01R31/2818 ,  G01R1/0416 ,  H05K13/0465 ,  H05K3/222 ,  H01R12/57

摘要： An electronic chip component for measurement formed by bending a plate material into a structure having an end face substantially in the shape of a square C comprises a cross-link section at the top portion thereof, leg sections formed individually on the opposite sides of the cross-link section, and foot sections formed by individually bending the respective lower end portions of the leg sections inward and each having a bent proximal end and a bent distal end, the respective distal ends of the foot sections facing each other across a space, and an the respective undersurfaces of the foot sections individually constituting joint surfaces to be bonded to the terminal surface, at least the lower parts of the respective outer surfaces of the leg sections and the respective outer surfaces of the foot sections being subjected to surface treatment for soldering.

摘要翻译： 用于通过将板材弯曲成具有大致呈方形C形状的端面的结构而形成的用于测量的电子芯片部件包括在其顶部处的横向连接部分，其横截面形成在十字形的相对侧上 链节部分和通过将腿部的各个下端部向内分别弯曲而形成的脚部，每个脚部具有弯曲的近端和弯曲的远端，所述脚部的各个远端跨越空间彼此面对，并且 分别构成要结合到端子表面的接合表面的脚部的各个下表面，至少脚部的各个外表面的下部和脚部的相应外表面经受表面处理以进行焊接 。

公开(公告)号：US6024586A

公开(公告)日：2000-02-15

申请号：US299101

申请日：1994-09-02

申请人： Yoshimitsu Kumagai

发明人： Yoshimitsu Kumagai

IPC分类号： H01R12/50 ,  H01R13/648

CPC分类号： H01R23/6873

摘要： A ground terminal, which is mounted to a printed board, includes a terminal body formed with a screw insertion hole, and a plurality of leads formed integrally with a lower end of the terminal body, these leads being connected to a printed board ground. The ground terminal is fastened at its terminal body, which is bent along the printed board, to a chassis ground of an electronic device by means of a screw which extends through the screw insertion hole. Thus, the printed board is electrically connected to the chassis through the ground terminal, and is hence grounded. The ground terminal is formed with a plurality of projections around the screw insertion hole. These projections are brought in urged contact with the chassis ground, to thereby prevent the ground terminal from being deformed while the ground terminal is fastened to the chassis. The terminal body has lead-side ends each of which obliquely extends to form an obtuse angle between itself and a corresponding one of the leads, to thereby prevent the ground terminal from injuring the printed board during the fastening.

摘要翻译： 安装到印刷电路板的接地端子包括形成有螺钉插入孔的端子体和与端子体的下端一体形成的多个引线，这些引线与印刷电路板接地连接。 接地端子通过螺钉延伸穿过螺钉插入孔而紧固在其沿着印刷电路板弯曲的终端主体到电子设备的机架接地处。 因此，印刷电路板通过接地端子电连接到机架，因此接地。 接地端子形成有围绕螺钉插入孔的多个突起。 这些突起被引导接触底盘接地，从而防止接地端子在接地端子被固定到机架上时变形。 端子体具有每个倾斜地延伸以在其自身和相应的一个引线之间形成钝角的引线端，从而防止接地端在紧固期间损伤印刷板。

公开(公告)号：US5984692A

公开(公告)日：1999-11-16

申请号：US121048

申请日：1998-07-23

申请人： Yoshimitsu Kumagai ,  Ryoji Tanaka

发明人： Yoshimitsu Kumagai ,  Ryoji Tanaka

IPC分类号： H01R11/01 ,  H01L23/498 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC分类号： H01R12/57 ,  H01L23/49811 ,  H05K3/3426 ,  H05K3/368 ,  H01L2924/0002 ,  H05K2201/1031 ,  Y02P70/611 ,  Y02P70/613

摘要： A board stacking connector chip, which is interposed between opposed first and second printed boards, for stacking both the printed boards, comprises an upper joint portion joined to a connection terminal of the first printed board, a pair of side portions which extend downward from terminal portions of the upper joint portion and are opposed to each other, and a pair of lower joint portions which extend by being bent inward transversely from the lower ends of side portions, being opposed to each other, and are joined to a connection terminal of the second printed board, the upper joint portion, paired side portions, and paired lower joint portions being formed into a substantially rectangular shape in section by bending a plate.

摘要翻译： 插入在相对的第一和第二印刷电路板之间用于堆叠两个印刷电路板的电路板堆叠连接器芯片包括接合到第一印刷电路板的连接端子的上部接合部分，从端子向下延伸的一对侧部 上接合部分的一部分并且彼此相对，并且一对下接合部分通过从侧部的下端横向向内弯曲而彼此相对延伸并且连接到第二接头部分的连接端子 第二印刷电路板，上接合部分，成对侧部分和成对的下接合部分通过弯曲板形成大致矩形的截面。