公开(公告)号：US20060102700A1

公开(公告)日：2006-05-18

申请号：US11025161

申请日：2004-12-29

Applicant: Ya-ling Huang ,  Di Li ,  Yu-cui He

Inventor： Ya-ling Huang ,  Di Li ,  Yu-cui He

IPC: B23K31/02 ,  B23K31/00

CPC classification number: H05K1/116 ,  B23K1/0016 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/097 ,  H05K2201/10189 ,  H05K2203/046

Abstract: A printed circuit board (100) includes a plurality of through-holes (26) defined therein, and a plurality of solder pads (20) defined to surround the through holes (26) respectively. Each of the solder pads (20) includes a first soldering zone (22) for accommodating solder used in a soldering process and a second soldering zone (28) in communication with the first soldering zone (22) for receiving excess solder extravasating from the first soldering zone (22). An axis of each of the solder pads (22) and a direction opposite to a movement direction of the printed circuit board (100) in the soldering process defines a predetermined angle.

Abstract translation: 印刷电路板（100）包括限定在其中的多个通孔（26）和限定为分别围绕通孔（26）的多个焊盘（20）。 每个焊盘（20）包括用于容纳焊接工艺中使用的焊料的第一焊接区（22）和与第一焊接区（22）连通的第二焊接区（28），用于接收从第一焊接区 焊接区（22）。 在焊接工艺中，每个焊盘（22）的轴线和与印刷电路板（100）的运动方向相反的方向限定了预定的角度。