公开(公告)号：US4887760A

公开(公告)日：1989-12-19

申请号：US89989

申请日：1987-08-27

申请人： Thunekazu Yoshino ,  Hiroshi Morita ,  Hirotaka Nakano ,  Nobuo Hayashi ,  Yuko Kubota

发明人： Thunekazu Yoshino ,  Hiroshi Morita ,  Hirotaka Nakano ,  Nobuo Hayashi ,  Yuko Kubota

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40

CPC分类号： H01L24/81 ,  H01L21/4839 ,  H01L23/49833 ,  H05K3/3436 ,  H01L2224/13111 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0108 ,  H05K2203/0405 ,  H05K3/3463 ,  H05K3/4084 ,  Y02P70/613

摘要： The bonding sheet of the present invention comprises a substrate having an opening, and a low-melting point bonding metal which closes the opening or is arranged on the peripheral portion of the opening, to project in the opening. According to a bonding sheet of the present invention, a low-melting point bonding metal is interposed between a conductor pattern of a substrate and electrode terminals of an electronic component, and is bonded by thermocompression at a low temperature without melting the low-melting point bonding metal, so that bonding of a large number of electrode terminals can be completed by a single bonding operation.

公开(公告)号：US20080009506A1

公开(公告)日：2008-01-10

申请号：US11662948

申请日：2005-09-16

申请人： Mari Kusama ,  Tatsuya Watanabe ,  Toshihiro Hosaka ,  Yuko Kubota

发明人： Mari Kusama ,  Tatsuya Watanabe ,  Toshihiro Hosaka ,  Yuko Kubota

IPC分类号： A61K31/4178 ,  A61K31/415 ,  A61K31/4155 ,  A61K31/42 ,  A61K31/44 ,  A61K31/47 ,  A61K31/506 ,  A61P13/00 ,  C07D215/12 ,  C07D403/14 ,  C07D403/04 ,  C07D401/04 ,  C07D277/30 ,  C07D263/08 ,  C07D235/02 ,  C07D233/60 ,  C07D233/56 ,  C07D233/00 ,  C07D513/04 ,  C07D413/04 ,  A61P9/00 ,  A61P11/06 ,  A61K31/497 ,  A61K31/4439 ,  A61K31/425 ,  A61K31/4184 ,  A61K31/4168

CPC分类号： C07D233/64 ,  C07D401/04 ,  C07D403/10 ,  C07D409/04 ,  C07D487/04

摘要： An imidazole compound of the formula: wherein Ring A is benzene or a heterocyclic ring; G is alkylthio, alkylsulfonyl, optionally substituted phenyl, or optionally substituted heterocyclic ring group, etc.; Ring C is imidazole; R1 is carbamoyl, etc.; R2 is cyano, nitro, hydroxyl, an alkoxy, a halogen, carboxy, an alkoxycarbonyl, carbamoyl, amino, an alkyl, etc.; m is 0 to 2; and R4 is hydrogen, an alkyl, etc., or a pharmaceutically acceptable salt thereof, is a large conductance calcium-activated K channel opener useful for treatment of pollakiuria, urinary incontinence, etc.

摘要翻译： 下式的咪唑化合物：其中环A是苯或杂环; G是烷硫基，烷基磺酰基，任选取代的苯基或任选取代的杂环基团等; 环C是咪唑; R 1是氨基甲酰基等; R 2是氰基，硝基，羟基，烷氧基，卤素，羧基，烷氧基羰基，氨基甲酰基，氨基，烷基等; m为0〜2; R 4是氢，烷基等或其药学上可接受的盐，是用于治疗尿频，尿失禁等的大电导钙激活K通道开放剂。