摘要:
The present invention relates to a method of forming micro patterns of a semiconductor device. In the method according to an aspect of the present invention, first etch mask patterns having a second pitch, which is twice larger than a first pitch of target patterns, are formed in a column direction over a semiconductor substrate. An auxiliary film is formed over the semiconductor substrate including a surface of the first etch mask patterns. An etch mask film is formed over the semiconductor substrate including the auxiliary film. An etch process is performed in order to form second etch mask patterns having the second pitch in such a manner that the etch mask film, the auxiliary film, and the first etch mask patterns are isolated from one another in a row direction and the etch mask film remains between the first etch mask patterns. The auxiliary film between the first and second etch mask patterns is removed.
摘要:
Disclosed herein is an image display device including a liquid crystal panel module for implementing an image; an image display device cover to which the liquid crystal panel module is mounted and fastened; an image display device pedestal base combined with the image display device cover to support the image display device; and a system board mounted within the image display device pedestal base.
摘要:
In a method of forming patterns of a semiconductor device, a semiconductor substrate defining photoresist patterns formed over a target etch layer is provided. An auxiliary layer is formed over the semiconductor substrate and the photoresist patterns. The auxiliary layer formed on a surface of the photoresist patterns is denatured into first auxiliary patterns. A photoresist film is formed over the semiconductor substrate, the first auxiliary patterns, and the auxiliary layer. The auxiliary layer formed below the photoresist film is denatured into a second auxiliary pattern. Here, the auxiliary layer remains only between the photoresist patterns. Etch mask patterns, including the photoresist patterns and the auxiliary layer, are formed by removing the photoresist film and the first and second auxiliary patterns.
摘要:
An LCD device includes: a liquid crystal panel configured to include liquid crystal cells formed in regions defined by crossing gate lines and data lines; an image analyzer configured to analyze whether or not an image data corresponds to a specific pattern in which a black or white gray-scale data having a large difference between positive and negative data voltages is continuously opposed to the liquid crystal cells of a vertical direction; a polarity control signal modulator configured to respond to a control signal from the image analyzer and modulate a polarity control signal, so as to prevent the black gray-scale data continuously opposed to the liquid crystal cells of the vertical direction from being polarity-inverted; and a data driver configured to apply the data voltages to the data lines on the basis of the modulated polarity control signal applied from the polarity control signal modulator.
摘要:
The present invention relates to a method of forming an etching mask pattern from developed negative and positive photoresist layers. According to the present invention, a negative photoresist layer is formed over a substrate. Some regions of the negative photoresist layer are exposed, thereby generating hydrogen ions within the exposed negative photoresist regions. The negative photoresist layer is developed so that the exposed negative photoresist regions remain. A positive photoresist layer is formed over the substrate including the remaining negative photoresist regions. The substrate is baked so that hydrogen ions within the remaining negative photoresist regions are diffused into the positive photoresist layer at boundary portions adjacent to the remaining negative photoresist regions. The positive photoresist layer is developed to remove the positive photoresist portions into which the hydrogen ions are diffused.
摘要:
A method of forming a micro pattern in a semiconductor device is disclosed. An oxide film mask is divided into a cell oxide film mask and a peri oxide film mask. Therefore, a connection between the cell and the peri region can be facilitated. A portion of a top surface of a first oxide film pattern between a region in which a word line will be formed and a region in which a select source line will be formed is removed. Accordingly, the space can be increased and program disturbance in the region in which the word line will be formed can be prevented. Furthermore, a pattern having a line of 50 nm and a space of 100 nm or a pattern having a line of 100 nm and a space of 50 nm, which exceeds the limitation of the ArF exposure equipment, can be formed using a pattern, which has a line of 100 nm and a space of 200 nm and therefore has a good process margin and a good critical dimension regularity.
摘要:
A method of fabricating a flash memory device, in which a pre-metal dielectric layer, a hard mask layer, and a first etch mask pattern are sequentially formed over a semiconductor substrate; an auxiliary layer is formed along a surface of the first etch mask pattern and the hard mask layer; and an etch mask layer is formed on the auxiliary layer to gap-fill between adjacent first etch mask pattern elements. The etch mask layer is etched to form a second etch mask pattern between adjacent first etch mask pattern elements. The auxiliary layer between the first and second etch mask patterns is removed; and a hard mask pattern is formed by etching the hard mask layer between the first etch mask pattern and the second etch mask pattern. The pre-metal dielectric layer is etched process using the hard mask pattern as a mask to form contact holes.
摘要:
The present invention relates to a method of fabricating a flash memory device. In a method according to an aspect of the present invention, a first hard mask film is formed over a semiconductor laminate. A plurality of first hard mask patterns are formed by etching an insulating layer for a hard mask. Spacers are formed on top surfaces and sidewalls of the plurality of first hard mask patterns. A second hard mask film is formed over a total surface including the spacers. Second hard mask patterns are formed in spaces between the spacers by performing an etch process so that a top surface of the spacers is exposed. The spacers are removed. Accordingly, gate patterns can be formed by employing hard mask patterns having a pitch of exposure equipment resolutions or less.
摘要:
A method of forming a micro pattern of a semiconductor device includes forming an etch target layer, a hard mask layer, a Bottom Anti-Reflective Coating (BARC) layer and a first photoresist pattern over a semiconductor substrate. An organic layer is formed on a surface of the first photoresist pattern. A second photoresist layer is formed over the BARC layer and the organic layer. An etch process is performed so that the second photoresist layer remains on the BARC layer between the first photoresist patterns and becomes a second photoresist pattern. The organic layer on the first photoresist pattern and between the first and second photoresist patterns is removed. The BARC layer formed below the organic layer is removed. The hard mask layer is etched using the first and second photoresist patterns as an etch mask. The etch target layer is etched using a hard mask pattern as an etch mask.
摘要:
A method of manufacturing a flash memory device includes providing a substrate having an insulating layer, a first mask layer over the insulating layer, a second mask layer over the first mask layer, a first photoresist pattern over the second mask layer, the first photoresist pattern having a first pitch. A material layer is provided over the first photoresist pattern. The material layer is etched to convert the material layer into a material layer pattern having a second pitch that is less than the first pitch. The second hard mask layer is etched using the material layer pattern to form a second hard mask layer pattern that extends along a first direction. A second photoresist pattern is etched, the second photoresist pattern defining a first region that is not exposed and a second region that is exposed, the second region extending along a second direction that is orthogonal to the first direction. The first hard mask layer is etched using the second photoresist pattern to form a first hard mask layer pattern having an angular shape.