IMAGE PROCESSING APPARATUS, IMAGE PROCESSING SYSTEM, IMAGE PROCESSING METHOD, AND RECORDING MEDIUM
    2.
    发明申请
    IMAGE PROCESSING APPARATUS, IMAGE PROCESSING SYSTEM, IMAGE PROCESSING METHOD, AND RECORDING MEDIUM 有权
    图像处理装置,图像处理系统,图像处理方法和记录介质

    公开(公告)号:US20160080605A1

    公开(公告)日:2016-03-17

    申请号:US14845557

    申请日:2015-09-04

    IPC分类号: H04N1/387 H04N1/00

    摘要: An image processing apparatus, an image processing system, and an image processing method, are provided, each of which receives a user instruction for printing an image on a plurality of recording sheets with an addition image being added to the image at a preset position in the image; generates a plurality of items of image data to be formed on the plurality of recording sheets so as to obtain the image when the plurality of recording sheets are pasted together; determines a specific recording sheet of the plurality of recording sheets and a specific position on the specific recording sheet, based on the preset position of the addition image, a number of the plurality of recording sheets for forming the image, and an image forming direction in forming the image on the plurality of recording sheets; and adds the addition image to an item of image data corresponding to the determined recording sheet at the specific position on the specific recording sheet.

    摘要翻译: 提供一种图像处理装置,图像处理系统和图像处理方法,每个图像处理装置接收在多个记录片材上打印图像的用户指令,其中附加图像被添加到图像的预设位置 图片; 生成要在多张记录纸张上形成的多个图像数据项目,以便当多张记录纸张被粘贴在一起时获得图像; 基于附加图像的预设位置,用于形成图像的多个记录片材的数量和图像形成方向,确定多个记录片材的特定记录片材和特定记录片材上的特定位置 在所述多张记录纸上形成图像; 并将添加图像添加到与特定记录纸张上的特定位置处的确定的记录纸张相对应的图像数据项目。

    Method of manufacturing an optical module using a mold die
    3.
    发明授权
    Method of manufacturing an optical module using a mold die 失效
    使用模具制造光学模块的方法

    公开(公告)号:US5275765A

    公开(公告)日:1994-01-04

    申请号:US824102

    申请日:1992-01-22

    IPC分类号: B29C45/14 G02B6/42

    摘要: A method of manufacture of an optical module using a mold die including cavity portions for holding an optical connector, electronic circuit parts, and lead pins which constitute component parts of the optical module, so as to form a package. The mold die has alignment portions in which rectangular channels for aligning the optical connector are formed. Partition plates are disposed vertically between the cavity portions and the alignment portions and adapted to prevent a resin from flowing out from the cavity portions during the resin molding. An optical connector, circuit parts, and lead pins are held in the die. Resin is injected into the cavity portion to form the optical module.

    摘要翻译: 一种使用模具制造的模块的制造方法,所述模具包括用于保持构成所述光学模块的组成部分的光学连接器,电子电路部件和引线引脚的空腔部分,以形成封装。 模具具有对准部分,其中形成用于对准光连接器的矩形通道。 分隔板垂直设置在空腔部分和对准部分之间,并且适于在树脂模制期间防止树脂从空腔部分流出。 光学连接器,电路部件和引脚被保持在管芯中。 将树脂注入空腔部分以形成光学模块。

    Process for producing optical module
    4.
    发明授权
    Process for producing optical module 失效
    生产光模块的过程

    公开(公告)号:US5099307A

    公开(公告)日:1992-03-24

    申请号:US588990

    申请日:1990-09-27

    IPC分类号: B29C70/72 G02B6/38 G02B6/42

    摘要: An optical sub-module comprises at least one optical connector; at least one optical operation element fixed to the optical connector; electronic circuit parts constituting an electronic circuit portion connected to the optical operation element; a substrate for supporting said electronic circuit parts; lead pins composed of inner leads and outer leads, inner leads being connected to electronic circuit portion; and a molding resin member holding the optical connector, the optical operation element, the electronic circuit parts, the substrate, and the lead pins in a body except for the outer leads of the lead pins and an end of the optical connector. An optical module comprises the sub-module and a molded receptacle having a first fitting portion into which the at least one optical connector is inserted so that the first fitting portion is fitted to the molding resin member, and a second fitting portion to which an optical plug holding the end of the optical fiber to be inserted in the optical connector, is fitted, the second fitting portion being communicated with the first fitting portion. The optical sub-module is formed through transfer molding.

    Image forming apparatus, security printing method, and storage medium
    5.
    发明授权
    Image forming apparatus, security printing method, and storage medium 有权
    图像形成装置,安全打印方法和存储介质

    公开(公告)号:US09333666B2

    公开(公告)日:2016-05-10

    申请号:US14584173

    申请日:2014-12-29

    摘要: An image forming apparatus having security printing function, connectable to a post-processing apparatus capable of cutting a sheet, includes a sheet size detector to detect a size of a sheet to be conducted with print processing, a dividing number acquiring unit to acquire a dividing number of the sheet, a sheet divider to divide the sheet into a plurality of areas based on the sheet size detected by the sheet size detector and the dividing number acquired by the dividing number acquiring unit, a security printing setting acquiring unit to acquire setting of a position of security printing, and a security printing position determination unit to determine a print position of security printing on each of the plurality of areas, divided by the sheet divider, based on the position of security printing acquired by the security printing setting acquiring unit.

    摘要翻译: 具有安全打印功能的图像形成装置,可连接到能够切割片材的后处理装置,包括用于检测要通过打印处理进行的片材的尺寸的片材尺寸检测器,分割数量获取单元, 纸张数量,基于由纸张尺寸检测器检测到的纸张尺寸和由分割数量获取单元获取的分割数量将纸张分成多个区域的纸张分割器,安全打印设置获取单元,用于获取纸张尺寸 安全打印的位置和安全打印位置确定单元,用于基于由安全打印设置获取单元获取的安全打印的位置来确定由分页器划分的多个区域中的每一个上的安全打印的打印位置 。

    Molded optical connector module
    6.
    发明授权
    Molded optical connector module 失效
    模制光连接器模块

    公开(公告)号:US5416871A

    公开(公告)日:1995-05-16

    申请号:US223663

    申请日:1994-04-06

    IPC分类号: H04B10/25 G02B6/12

    摘要: An optical module comprises an optical connector at the receiver side and an optical connector at the transmitter side, and hybrid IC for the receiver side and the transmitter side are mounted on a lead frame. The lead frame comprises a projecting part projecting outside from a part where each semiconductor chip is mounted. Nearby the connection part between the optical connector and the hybrid IC, the projecting part is connected to a ground pattern on a surface of the hybrid IC by a bonding wire. The wire is placed at this location, so that the effect of noise caused by an atmospheric electric wave, or GND/power lines can be reduced.

    摘要翻译: 光学模块包括在接收机侧的光学连接器和发射机侧的光学连接器,并且用于接收机侧和发射机侧的混合IC安装在引线框架上。 引线框架包括从安装每个半导体芯片的部分向外突出的突出部分。 在光连接器和混合IC之间的连接部分附近,突出部分通过接合线连接到混合IC的表面上的接地图案。 电线放置在该位置,可以降低由大气电波或GND /电源线引起的噪音的影响。

    Optical module having dimensional accuracy
    9.
    发明授权
    Optical module having dimensional accuracy 失效
    具有尺寸精度的光学模块

    公开(公告)号:US5361318A

    公开(公告)日:1994-11-01

    申请号:US11699

    申请日:1993-02-01

    摘要: An optical sub-module comprises at least one optical connector; at least one optical operation element fixed to the optical connector; electronic circuit parts constituting an electronic circuit portion connected to the optical operation element; a substrate for supporting said electronic circuit parts; lead pins composed of inner leads and outer leads, inner leads being connected to electronic circuit portion; and a molding resin member holding the optical connector, the optical operation element, the electronic circuit parts, the substrate, and the lead pins in a body except for the outer leads of the lead pins and an end of the optical connector. An optical module comprises the sub-module and a molded receptacle having a first fitting portion into which the at least one optical connector is inserted so that the first fitting portion is fitted to the molding resin member, and a second fitting portion to which an optical plug holding the end of the optical fiber to be inserted in the optical connector, is fitted, the second fitting portion being communicated with the first fitting portion. The optical sub-module is formed through transfer molding.

    摘要翻译: 光学子模块包括至少一个光学连接器; 至少一个光学操作元件固定到光学连接器; 构成与光操作元件连接的电子电路部的电子电路部; 用于支撑所述电子电路部件的基板; 引脚由内引线和外引线组成,内引线连接到电子电路部分; 以及保持光连接器,光操作元件,电子电路部件,基板和引线销的成型树脂部件,除了引线销的外引线和光连接器的端部之外的主体中。 光学模块包括子模块和模制插座,其具有第一装配部分,至少一个光学连接器插入其中,使得第一装配部分装配到模制树脂构件,以及第二装配部分,光学元件 固定插入在光连接器中的光纤的端部的插头被安装,第二配合部分与第一配件部分连通。 光学子模块通过传递模塑形成。

    Information processing apparatus
    10.
    发明授权

    公开(公告)号:US10182175B2

    公开(公告)日:2019-01-15

    申请号:US15467063

    申请日:2017-03-23

    IPC分类号: H04N1/387 H04N1/32

    摘要: An information processing apparatus includes a manuscript reader configured to read a manuscript, an embedment processing unit configured to perform a process of embedding additional information into data of the manuscript that has been read by the manuscript reader. The embedment processing unit embeds, as the additional information, a pattern including a plurality of dots arranged in such a shape that an inclination of the manuscript is detectable.