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1.发明申请METHOD AND APPARATUS FOR MEASURING A FREE AIR BALL SIZE DURING WIRE BONDING 审中-公开用于在线接合期间测量自由空气球尺寸的方法和装置公开(公告)号：US20150008251A1
公开(公告)日：2015-01-08
申请号：US14320851
申请日：2014-07-01
Applicant: Keng Yew SONG , Yi Bin WANG , Zuo Cheng SHEN , Jia Le LUO , Qing Le TAN
Inventor： Keng Yew SONG , Yi Bin WANG , Zuo Cheng SHEN , Jia Le LUO , Qing Le TAN
CPC classification number: H01L24/78 , B23K20/007 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78 , H01L2224/78268 , H01L2224/78301 , H01L2224/789 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.
Abstract translation: 公开了一种在引线接合机的引线接合工艺期间测量自由空气球尺寸的方法，其包括位置传感器和用于使用接合线在半导体器件和基板之间形成电连接的接合工具。 具体地说，该方法包括以下步骤：从接合线的线尾形成自由空气球; 使用所述位置传感器来确定所述接合工具相对于参考位置的第一和第二位置之间的位置差异，其中所述接合工具的所述第一位置是所述接合工具相对于所述参考位置的位置， 自由空气球接触导电表面; 并且基于由位置传感器确定的接合工具的位置差来测量自由空气球尺寸。 还公开了构造成执行这种方法的引线接合器。
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公开(公告)号：US07214606B2
公开(公告)日：2007-05-08
申请号：US10798053
申请日：2004-03-11
Applicant: Yam Mo Wong , Chee Wai Siew , Wei Liu , Zuo Cheng Shen
Inventor： Yam Mo Wong , Chee Wai Siew , Wei Liu , Zuo Cheng Shen
CPC classification number: H01L24/48 , H01L24/45 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48455 , H01L2224/48599 , H01L2224/48699 , H01L2224/48997 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00015 , H01L2224/05599
Abstract: The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.
Abstract translation: 本发明提供一种将电线连接到电子设备的连接焊盘上的引线键合以及形成引线接合的方法。 在连接焊盘上形成第一缝合接头，接下来形成与第一针迹接合的连接焊盘上的第二缝合。
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公开(公告)号：US10163845B2
公开(公告)日：2018-12-25
申请号：US14320851
申请日：2014-07-01
Applicant: Keng Yew Song , Yi Bin Wang , Zuo Cheng Shen , Jia Le Luo , Qing Le Tan
Inventor： Keng Yew Song , Yi Bin Wang , Zuo Cheng Shen , Jia Le Luo , Qing Le Tan
Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.
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