公开(公告)号：US20170290212A1

公开(公告)日：2017-10-05

申请号：US15626373

申请日：2017-06-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agacaoili Narag ,  Siang Sin Foo ,  Fong Liang Tan ,  Wei Meng Pee ,  Andrew J. Ouderkirk ,  Justine A. Mooney

IPC: H01L23/498 ,  H01L33/62

CPC classification number: H01L23/4985 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/49872 ,  H01L24/17 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/10106

Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.