公开(公告)号：US10014456B2

公开(公告)日：2018-07-03

申请号：US15128500

申请日：2015-03-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin Agcaoili Narag, II ,  Dong-Soo Lee ,  Dominic M. Travasso

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/46 ,  H01L33/48 ,  H01L21/48 ,  H01L23/498 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L33/46 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: Flexible LED assemblies that have coplanar integrated conductive features upon which an LED can be mounted, and methods of making such LED assemblies are described. The flexible LED assembly includes a flexible polymer substrate, a first conductive feature, a second conductive feature and an LED. The first conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The second conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The first and second conductive features are separated by a gap therebetween. The LED is mounted on both the first and second conductive features, and the first and second conductive features are substantially coplanar with one another.