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    CURVED SHIELD ON A CIRCUIT BOARD
    2.
    发明申请
    CURVED SHIELD ON A CIRCUIT BOARD 审中-公开

    公开(公告)号：US20180249599A1

    公开(公告)日：2018-08-30

    申请号：US15755207

    申请日：2016-09-19

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jin-Bae Kim ,  Jung-Ju Suh ,  Jeongwan Choi

    IPC: H05K9/00 ,  H05K1/18 ,  H05K1/02

    CPC classification number: H05K9/0032 ,  H05K1/0216 ,  H05K1/181 ,  H05K2201/09018 ,  H05K2201/10371 ,  H05K2201/10522 ,  H05K2201/2018

    Abstract: A system includes a curved circuit board with at least one electronic component mounted on the circuit board and electrically connected to a first electrically conductive trace of the circuit board. The system includes an electrically conductive curved fence conformably attached to the circuit board and surrounding the at least one electronic component. The fence is electrically connected to a different second electrically conductive trace of the circuit board. The system further includes an electrically conductive lid conformably attached to a top side of the fence. The electrically conductive lid covers the at least one electronic component. The fence comprises a plurality of spaced apart first tabs arranged along at least a first portion of a perimeter of the fence. Each first tab has a free end and is attached to the electrically conductive lid or the circuit board.

    SHIELDING TAPE FOR ELECTROMAGNETIC WAVE
    5.
    发明申请
    SHIELDING TAPE FOR ELECTROMAGNETIC WAVE 有权

    公开(公告)号：US20210076547A1

    公开(公告)日：2021-03-11

    申请号：US15733782

    申请日：2019-05-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Seong-Woo Woo ,  Jung-Ju Suh

    IPC: H05K9/00 ,  C09J7/29 ,  B32B3/08 ,  B32B25/04

    Abstract: A shielding tape according to an embodiment of the present disclosure includes a plurality of shielding members discrete from one another on a same plane, and, when the shielding tape is stretched in a first direction which is perpendicular to a thickness direction of the shielding tape, a distance between at least a portion of the shielding members increases, and a distance between the other portion of the shielding members is reduced.

    Force responsive inductors for force sensors
    7.
    发明授权
    Force responsive inductors for force sensors 有权

    公开(公告)号：US10401238B2

    公开(公告)日：2019-09-03

    申请号：US15120809

    申请日：2015-02-23

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Andrew P. Bonifas ,  Jaewon Kim ,  Jung-Ju Suh

    IPC: G01L1/14

    Abstract: In some examples, a sensor comprises a circuit including an inductor. The inductor comprises an inductor layer, a reference layer comprising at least one of an electrically conductive material or a magnetic material, and a variable layer formed between the reference layer and inductor layer. A thickness of the variable layer may be configured to change upon application of a force external to the variable layer thereby causing a change in position of the reference layer relative the inductor layer, and the change in position of the reference layer relative the inductor layer changes an inductance of the inductor. The sensor may be configured to detect the force based on the change in inductance of the inductor.

    Electronic circuit board assembly including EMI shielding structure and thermal pad
    9.
    发明授权
    Electronic circuit board assembly including EMI shielding structure and thermal pad 有权

    公开(公告)号：US10104763B2

    公开(公告)日：2018-10-16

    申请号：US15328535

    申请日：2015-10-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Mihee Lee ,  Jung-Ju Suh

    IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00 ,  G06F1/20 ,  H01L23/473 ,  H04M1/02

    Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.

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