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    ELECTRONIC ASSEMBLY AND METHOD FOR FABRICATING THE SAME
    1.
    发明公开
    ELECTRONIC ASSEMBLY AND METHOD FOR FABRICATING THE SAME 审中-公开

    公开(公告)号：US20240063139A1

    公开(公告)日：2024-02-22

    申请号：US18278681

    申请日：2022-01-28

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jiwoong Kong ,  Jung Ju Suh

    IPC: H01L23/552 ,  H01L21/56 ,  H01L25/065

    CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L25/0655 ,  H01L23/3128

    Abstract: The present disclosure relates to an electronic assembly. Specifically, according to an embodiment of the present disclosure, there is provided an electronic assembly including: a circuit board including a plurality of electric conductive connectors; a plurality of spaced semiconductor integrated circuits coupled to a first main surface of the circuit board; a cover layer disposed on the semiconductor integrated circuit to substantially enclose and to cover the semiconductor integrated circuit; a plurality of solder bumps disposed on a second main surface facing the first main surface of the circuit board in order to provide an electric connection to the electronic assembly; a first metal foil layer comprising a cut portion to expose the solder bump, and bonded to the second main surface of the circuit board; and a metal coating layer which is conformally coated over an upper surface of the electronic assembly on the first main surface of the circuit board, and is extended toward the second main surface of the circuit board across edges of the electronic assembly in order to physically, electrically contact the metal foil layer, and to coat side surfaces of the electronic assembly.

    ANTENNA FOR TRANSFER OF INFORMATION OR ENERGY
    3.
    发明申请
    ANTENNA FOR TRANSFER OF INFORMATION OR ENERGY 有权

    公开(公告)号：US20230077474A1

    公开(公告)日：2023-03-16

    申请号：US17800384

    申请日：2021-02-24

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Seong-Woo Woo ,  Jinwook Kim ,  Jung Ju Suh ,  Jennifer J. Sokol ,  Charles L. Bruzzone

    IPC: H04B5/00 ,  H01F27/28 ,  H01F38/14 ,  H01F5/00

    Abstract: An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

    VARIABLE MAGNETIC LAYER FOR WIRELESS CHARGING
    4.
    发明申请
    VARIABLE MAGNETIC LAYER FOR WIRELESS CHARGING 有权

    公开(公告)号：US20220375683A1

    公开(公告)日：2022-11-24

    申请号：US17765171

    申请日：2020-10-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Zohaib Hameed ,  Milo G. Oien-Rochat ,  Charles L. Bruzzone ,  Charles D. Hoyle ,  Michael D. Benson ,  Jennifer J. Sokol ,  Jung Ju Suh

    IPC: H01F38/14 ,  H01F27/36 ,  H01F27/28

    Abstract: A magnetic film assembly includes a coil having a plurality of turns defining a first major boundary surface of the coil, such that when energized, the coil generates an in-plane magnetic field component in a region of interest in air proximate and substantially parallel to the first major boundary surface, the in-plane magnetic field component having a magnetic field strength H that varies between a maximum Hmax and about 10% of Hmax in the region of interest in air; and a magnetic layer disposed on the coil so as to include the region of interest, such that when energized, the coil generates a magnetic field inducing an in-plane magnetic flux density B in the magnetic layer in the region of interest that varies less than about 5% in the region of interest.

    Antenna assemblies
    5.
    发明授权
    Antenna assemblies 有权

    公开(公告)号：US12300893B2

    公开(公告)日：2025-05-13

    申请号：US17910107

    申请日：2021-03-24

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Charles L. Bruzzone

    IPC: H01Q21/06 ,  H01Q1/38 ,  H01Q23/00

    Abstract: An electronic assembly includes a circuit board including a plurality of electrically conductive traces, a cover layer disposed on the circuit board, and a plurality of antenna assemblies disposed on a major top surface of the cover layer and exposing the major top surface therebetween. Each of the antenna assemblies includes an antenna and an adhesive layer bonding the antenna to the major top surface of the cover layer. The antenna is electrically coupled to a corresponding different trace in the plurality of traces. The adhesive layers in the antenna assemblies have substantially a same first composition and a same average first thickness. The antennas in the antenna assemblies have substantially a same second composition and a same average second thickness greater than about 5 microns. The electronic assembly can be singulated to provide antenna assemblies. Methods of making the assemblies are also described.

    ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND METHOD FOR FABRICATING ELECTRONIC ASSEMBLY
    8.
    发明申请
    ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND METHOD FOR FABRICATING ELECTRONIC ASSEMBLY 有权

    公开(公告)号：US20210202401A1

    公开(公告)日：2021-07-01

    申请号：US17249559

    申请日：2021-03-05

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

    IPC: H01L23/552 ,  H05K9/00

    Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

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