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公开(公告)号:US12112993B2
公开(公告)日:2024-10-08
申请号:US17289259
申请日:2019-08-30
Applicant: A.L.M.T. Corp.
Inventor: Ryota Matsugi , Isao Iwayama , Chieko Tanaka , Hideaki Morigami
IPC: H01L23/373 , B23K1/00 , B23K35/32 , B23K101/40 , B23K103/00 , B23K103/16
CPC classification number: H01L23/3732 , B23K1/0016 , B23K35/325 , H01L23/3736 , B23K2101/40 , B23K2103/172 , B23K2103/56
Abstract: A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulating plate provided on at least a part of front and rear surfaces of the substrate and composed of an aluminum nitride, and a single bonding layer interposed between the substrate and the insulating plate, the heat radiation member having thermal conductivity not lower than 400 W/m·K.
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公开(公告)号:US11668009B2
公开(公告)日:2023-06-06
申请号:US16969238
申请日:2019-01-30
Applicant: Sumitomo Electric Industries, Ltd. , A.L.M.T. Corp.
Inventor: Kengo Goto , Tomoaki Ikeda , Akihisa Hosoe , Masanori Sugisawa , Fukuto Ishikawa , Hideaki Morigami
IPC: C23C18/16 , C23C18/18 , C23C26/00 , C23C18/50 , C22C26/00 , B32B15/04 , H01L23/373 , C22C1/04 , C22C1/05 , C22C5/06 , C23C18/32 , H01L21/48 , B32B19/00 , B32B15/16 , B32B19/04 , B22F7/02
CPC classification number: C23C18/1651 , B32B15/04 , B32B15/043 , B32B15/16 , B32B19/00 , B32B19/041 , C22C1/0466 , C22C1/05 , C22C5/06 , C22C26/00 , C23C18/1637 , C23C18/1803 , C23C18/1827 , C23C18/1844 , C23C18/1879 , C23C18/32 , C23C18/50 , H01L21/4871 , H01L23/3732 , H01L23/3736 , B22F7/02 , B22F2998/10 , B22F2999/00 , B32B2255/06 , B32B2255/205 , B32B2255/28 , Y10T428/12493 , Y10T428/12535 , Y10T428/12625 , Y10T428/12868 , Y10T428/12875 , Y10T428/12944 , Y10T428/12993 , B22F2999/00 , B22F7/02 , C22C1/05 , C22C26/00 , C22C1/0466 , B22F2998/10 , B22F7/02 , B22F2003/247 , B22F2003/244 , B22F2003/242
Abstract: A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.
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