公开(公告)号：US20230199958A1

公开(公告)日：2023-06-22

申请号：US17554288

申请日：2021-12-17

Applicant: ABB Schweiz AG

Inventor： John Andrew Trelford ,  Robert Joseph Roessler ,  Jose Daniel Rogers ,  Arturo Silva ,  Alok Lohia

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0206 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/421 ,  H05K1/184

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

公开(公告)号：US11792928B2

公开(公告)日：2023-10-17

申请号：US17554288

申请日：2021-12-17

Applicant: ABB Schweiz AG

Inventor： John Andrew Trelford ,  Robert Joseph Roessler ,  Jose Daniel Rogers ,  Arturo Silva ,  Alok Lohia

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/0206 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/421 ,  H05K1/184 ,  H05K3/429 ,  H05K2201/0979 ,  H05K2201/09518

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.