公开(公告)号：US20230199958A1

公开(公告)日：2023-06-22

申请号：US17554288

申请日：2021-12-17

Applicant: ABB Schweiz AG

Inventor： John Andrew Trelford ,  Robert Joseph Roessler ,  Jose Daniel Rogers ,  Arturo Silva ,  Alok Lohia

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0206 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/421 ,  H05K1/184

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

公开(公告)号：US20230189427A1

公开(公告)日：2023-06-15

申请号：US17550707

申请日：2021-12-14

Applicant: ABB Schweiz AG

Inventor： John Andrew Trelford ,  Alok K. Lohia ,  Arturo Silva

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/0203 ,  H05K7/2039 ,  H05K1/181 ,  H05K1/141 ,  H05K2201/1003

Abstract: A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network.

公开(公告)号：US11259413B2

公开(公告)日：2022-02-22

申请号：US15946151

申请日：2018-04-05

Applicant: ABB Schweiz AG

Inventor： Arturo Silva ,  Loc Ngo

IPC: H01F27/24 ,  H05K1/18 ,  H01F27/28 ,  H02M1/14 ,  H05K3/30

Abstract: A power supply circuit includes a printed circuit board (PCB), and a transformer coupled to the PCB. The power supply circuit also includes a first inductor assembly coupled to the PCB and electrically connected to the transformer, and a second inductor assembly coupled to the PCB and electrically connected to the transformer. The first inductor assembly has an inner edge and an opposite outer edge, and the second inductor assembly has an inner edge and an opposite outer edge. The inner edge of the second inductor assembly is spaced apart from the inner edge of the first inductor assembly by a gap. The power supply circuit also includes a first magnetic shunt coupled to the outer edge of the first inductor assembly, and a second magnetic shunt coupled to the outer edge of the second inductor assembly.

公开(公告)号：US20190028034A1

公开(公告)日：2019-01-24

申请号：US15657786

申请日：2017-07-24

Applicant: ABB Schweiz AG

Inventor： Arturo Silva ,  Loc Ngo ,  Richard Yeager ,  Jouni Uusitalo

IPC: H02M3/335 ,  H05K1/18

CPC classification number: H02M3/33569 ,  H02M3/285 ,  H02M3/3353 ,  H02M3/33592 ,  H05K1/0263 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/09 ,  H05K2201/10303

Abstract: A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.

公开(公告)号：US20230260690A1

公开(公告)日：2023-08-17

申请号：US17673163

申请日：2022-02-16

Applicant: ABB Schweiz AG

Inventor： Arturo Silva ,  Alok K. Lohia ,  Robert J. Catalano

IPC: H01F27/29 ,  H05K1/16 ,  H01F27/28 ,  H01F27/30 ,  H02M3/00 ,  H02M3/158

CPC classification number: H01F27/292 ,  H05K1/165 ,  H01F27/2804 ,  H01F27/306 ,  H02M3/01 ,  H02M3/1582 ,  H01F2027/2814

Abstract: An inductor is disposed above and mounted on a printed wire board. The inductor includes a winding and a core. The winding includes first and second terminations that are electrically connected to the printed wire board at different locations. The core includes: a first section including magnetic material with a channel along an inner surface, to receive the winding, and ending at or above first and second bottom corners of the inner surface; a second section that is a mirror image of the first section including an inner surface that faces the inner surface of the first section; and a distributed gap that uniformly separates the first section from the second section except where the winding passes along the mirror-image channels. The winding lies along the distributed gap in the mirror-image channels, and the winding spatially divides the core into an upper and lower portions of equal volume.

公开(公告)号：US20190313531A1

公开(公告)日：2019-10-10

申请号：US15946151

申请日：2018-04-05

Applicant: ABB Schweiz AG

Inventor： Arturo Silva ,  Loc Ngo

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/28 ,  H05K3/30 ,  H02M1/14

Abstract: A power supply circuit includes a printed circuit board (PCB), and a transformer coupled to the PCB. The power supply circuit also includes a first inductor assembly coupled to the PCB and electrically connected to the transformer, and a second inductor assembly coupled to the PCB and electrically connected to the transformer. The first inductor assembly has an inner edge and an opposite outer edge, and the second inductor assembly has an inner edge and an opposite outer edge. The inner edge of the second inductor assembly is spaced apart from the inner edge of the first inductor assembly by a gap. The power supply circuit also includes a first magnetic shunt coupled to the outer edge of the first inductor assembly, and a second magnetic shunt coupled to the outer edge of the second inductor assembly.

公开(公告)号：US11792928B2

公开(公告)日：2023-10-17

申请号：US17554288

申请日：2021-12-17

Applicant: ABB Schweiz AG

Inventor： John Andrew Trelford ,  Robert Joseph Roessler ,  Jose Daniel Rogers ,  Arturo Silva ,  Alok Lohia

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/0206 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/421 ,  H05K1/184 ,  H05K3/429 ,  H05K2201/0979 ,  H05K2201/09518

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

公开(公告)号：US11770900B2

公开(公告)日：2023-09-26

申请号：US17546812

申请日：2021-12-09

Applicant: ABB Schweiz AG

Inventor： Alok K. Lohia ,  Arturo Silva ,  Robert J. Catalano ,  Robert J. Roessler

IPC: H05K1/18 ,  H02M3/00 ,  H05K1/11 ,  H02M7/00

CPC classification number: H05K1/184 ,  H02M3/003 ,  H02M7/003 ,  H05K1/114 ,  H05K2201/1003

Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly comprises a printed wiring board (PWB) and one or more electrical components mounted thereon. The PWB comprises a plurality of layers including conductive layers and insulative layers, where one or more of the insulative layers is a prepreg layer that is halogen-free; one or more slotted portions on a surface of the PWB, which are indented into the PWB; and one or more pads disposed on the surface of the PWB, which are paired with the one or more slotted portions. Each of the one or more electrical components is mounted on the surface of the PWB through a pair of a slotted portion and a pad.

公开(公告)号：US20230189443A1

公开(公告)日：2023-06-15

申请号：US17546812

申请日：2021-12-09

Applicant: ABB Schweiz AG

Inventor： Alok K. Lohia ,  Arturo Silva ,  Robert J. Catalano ,  Robert J. Roessler

IPC: H05K1/18 ,  H02M3/00 ,  H02M7/00 ,  H05K1/11

CPC classification number: H05K1/184 ,  H02M3/003 ,  H02M7/003 ,  H05K1/114 ,  H05K2201/1003

Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly comprises a printed wiring board (PWB) and one or more electrical components mounted thereon. The PWB comprises a plurality of layers including conductive layers and insulative layers, where one or more of the insulative layers is a prepreg layer that is halogen-free; one or more slotted portions on a surface of the PWB, which are indented into the PWB; and one or more pads disposed on the surface of the PWB, which are paired with the one or more slotted portions. Each of the one or more electrical components is mounted on the surface of the PWB through a pair of a slotted portion and a pad.