公开(公告)号：US20160079156A1

公开(公告)日：2016-03-17

申请号：US14827884

申请日：2015-08-17

Applicant: ABB Technology Oy

Inventor： Chunlei Liu ,  Didier Cottet ,  Franziska Brem ,  Slavo Kicin

IPC: H01L23/498 ,  H01L25/07 ,  H01L21/48 ,  H01L23/367 ,  H01L25/00 ,  H01L23/495 ,  H01L25/18

CPC classification number: H01L23/49861 ,  H01L21/4821 ,  H01L21/4846 ,  H01L23/142 ,  H01L23/3675 ,  H01L23/492 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/071 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8384 ,  H01L2224/92244 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/00

Abstract: The present disclosure describes a power electronics module comprising a lead frame in which a chip of a first semiconductor device is embedded, a first PCB mounted on top of the lead frame and the chip of the first semiconductor device, and a support frame mounted on top of the PCB, the support frame comprising a cavity in which the chip of a second semiconductor device is embedded, wherein the chips of the first semiconductor device and the second semiconductor device are positioned on top of each other, and the first PCB comprises a first electrically conducting path between the chips of the first semiconductor device and the second semiconductor device.

Abstract translation: 本公开描述了一种电力电子模块，其包括引线框架，其中嵌入有第一半导体器件的芯片，安装在引线框架的顶部上的第一PCB和第一半导体器件的芯片，以及安装在顶部的支撑框架 所述支撑框架包括其中嵌入有第二半导体器件的芯片的空腔，其中所述第一半导体器件和所述第二半导体器件的芯片位于彼此的顶部，并且所述第一PCB包括第一 在第一半导体器件的芯片与第二半导体器件之间的导电路径。