公开(公告)号：US20240114658A1

公开(公告)日：2024-04-04

申请号：US17956799

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHRISTOPHER M. HELBERG ,  CHRISTOPHER M. JAGGERS ,  ROBERT EDWARD RADKE ,  MUSTANSIR M. PRATAPGARHWALA ,  MICHAEL J. AUSTIN ,  SUKESH SHENOY

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20327 ,  G06F2200/201

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

公开(公告)号：US20240111344A1

公开(公告)日：2024-04-04

申请号：US17956821

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： MICHAEL J. AUSTIN ,  CHRISTOPHER M. HELBERG ,  SUKESH SHENOY ,  CHRISTOPHER M. JAGGERS

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K7/2039

Abstract: An apparatus for component cooling includes a thermoelectric cooling (TEC) device configured to be thermally coupled to a first processor, and a controller. The controller is configured to receive at least one first parameter indicative of a first activity level of the first processor; determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter; and control providing of power to the TEC device at the determined TEC power level.