公开(公告)号：US20240111343A1

公开(公告)日：2024-04-04

申请号：US17956796

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： MUSTANSIR M. PRATAPGARHWALA ,  CHRISTOPHER M. JAGGERS ,  CHRISTOPHER M. HELBERG

IPC: G06F1/20 ,  G06F9/48

CPC classification number: G06F1/206 ,  G06F9/4893

Abstract: A method for configuring a processor includes identifying a component cooling device thermally coupled to a processor, and configuring one or more operating parameters of the processor based on the identification of the component cooling device.

公开(公告)号：US20210182163A1

公开(公告)日：2021-06-17

申请号：US16715831

申请日：2019-12-16

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： AMITABH MEHRA ,  ANIL HARWANI ,  WILLIAM R. ALVERSON ,  GRANT E. LEY ,  JERRY A. AHRENS ,  MUSTANSIR M. PRATAPGARHWALA ,  SCOTT E. SWANSTROM

IPC: G06F11/22 ,  G06F21/57

Abstract: Automatic part testing includes: booting a part under testing into a first operating environment; executing, via the first operating environment, one or more test patterns on the part; performing a comparison between one or more observed characteristics associated with the one or more test patterns and one or more expected characteristics; and modifying one or more operational parameters of a central processing unit of the part based on the comparison.

公开(公告)号：US20240114658A1

公开(公告)日：2024-04-04

申请号：US17956799

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHRISTOPHER M. HELBERG ,  CHRISTOPHER M. JAGGERS ,  ROBERT EDWARD RADKE ,  MUSTANSIR M. PRATAPGARHWALA ,  MICHAEL J. AUSTIN ,  SUKESH SHENOY

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20327 ,  G06F2200/201

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

公开(公告)号：US20210349797A1

公开(公告)日：2021-11-11

申请号：US17379442

申请日：2021-07-19

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： AMITABH MEHRA ,  ANIL HARWANI ,  WILLIAM R. ALVERSON ,  GRANT E. LEY ,  JERRY A. AHRENS ,  MUSTANSIR M. PRATAPGARHWALA ,  SCOTT E. SWANSTROM

IPC: G06F11/22

Abstract: Automatic part testing includes: booting a part under testing into a first operating environment; executing, via the first operating environment, one or more test patterns on the part; performing a comparison between one or more observed characteristics associated with the one or more test patterns and one or more expected characteristics; and modifying one or more operational parameters of a central processing unit of the part based on the comparison.