公开(公告)号：US20240114664A1

公开(公告)日：2024-04-04

申请号：US17956813

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： ROBERT EDWARD RADKE

IPC: H05K7/20 ,  F16F1/18 ,  G06F1/20

CPC classification number: H05K7/2049 ,  F16F1/18 ,  G06F1/20 ,  H05K7/20254 ,  G06F2200/201

Abstract: An apparatus for component cooling includes a manifold and a heat transfer element configured to be thermally coupled to a heat-generating component. The apparatus further includes a first spring mechanism between the manifold and the heat transfer element. The first spring mechanism is configured to apply a first force to the heat transfer element.

公开(公告)号：US20240111269A1

公开(公告)日：2024-04-04

申请号：US17956793

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHRISTOPHER M. JAGGERS ,  ROBERT EDWARD RADKE ,  CHRISTOPHER M. HELBERG

IPC: G05B19/416 ,  G06F1/20

CPC classification number: G05B19/416 ,  G06F1/20 ,  G05B2219/45006 ,  G05B2219/49216

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.

公开(公告)号：US20240114658A1

公开(公告)日：2024-04-04

申请号：US17956799

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHRISTOPHER M. HELBERG ,  CHRISTOPHER M. JAGGERS ,  ROBERT EDWARD RADKE ,  MUSTANSIR M. PRATAPGARHWALA ,  MICHAEL J. AUSTIN ,  SUKESH SHENOY

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20327 ,  G06F2200/201

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

公开(公告)号：US20240114657A1

公开(公告)日：2024-04-04

申请号：US17956789

申请日：2022-09-29

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHRISTOPHER M. HELBERG ,  CHRISTOPHER M. JAGGERS ,  ROBERT EDWARD RADKE

IPC: H05K7/20 ,  F25B21/02 ,  G06F1/20

CPC classification number: H05K7/20336 ,  F25B21/02 ,  G06F1/206 ,  H05K7/20154 ,  H05K7/20254 ,  H05K7/20327 ,  H05K7/2039 ,  F25B2321/023 ,  F25B2321/0252

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component, and a second heat transfer element. The apparatus further includes a plurality of thermally conductive paths between the first heat transfer element and the second heat transfer element. Each of the plurality of thermally conductive paths are configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element.