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公开(公告)号：US20220415866A1
公开(公告)日：2022-12-29
申请号：US17360862
申请日：2021-06-28
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： CHRISTOPHER M. JAGGERS
Abstract: An apparatus for a common cooling solution for multiple packages of a common height, including: a first die package; a second die package having a same height as the first die package; and a cooling element thermally coupled to the first die package and the second die package by a planar surface of the cooling element.
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公开(公告)号：US20240111269A1
公开(公告)日：2024-04-04
申请号：US17956793
申请日：2022-09-29
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： CHRISTOPHER M. JAGGERS , ROBERT EDWARD RADKE , CHRISTOPHER M. HELBERG
IPC: G05B19/416 , G06F1/20
CPC classification number: G05B19/416 , G06F1/20 , G05B2219/45006 , G05B2219/49216
Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.
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公开(公告)号：US20240111343A1
公开(公告)日：2024-04-04
申请号：US17956796
申请日：2022-09-29
Applicant: ADVANCED MICRO DEVICES, INC.
CPC classification number: G06F1/206 , G06F9/4893
Abstract: A method for configuring a processor includes identifying a component cooling device thermally coupled to a processor, and configuring one or more operating parameters of the processor based on the identification of the component cooling device.
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公开(公告)号：US20230098181A1
公开(公告)日：2023-03-30
申请号：US17485966
申请日：2021-09-27
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： CHRISTOPHER M. JAGGERS
Abstract: A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.
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Patent Agency Ranking
5.发明公开公开(公告)号：US20240111344A1
公开(公告)日：2024-04-04
申请号：US17956821
申请日：2022-09-29
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： MICHAEL J. AUSTIN , CHRISTOPHER M. HELBERG , SUKESH SHENOY , CHRISTOPHER M. JAGGERS
CPC classification number: G06F1/206 , H05K7/2039
Abstract: An apparatus for component cooling includes a thermoelectric cooling (TEC) device configured to be thermally coupled to a first processor, and a controller. The controller is configured to receive at least one first parameter indicative of a first activity level of the first processor; determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter; and control providing of power to the TEC device at the determined TEC power level.
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公开(公告)号：US20230095467A1
公开(公告)日：2023-03-30
申请号：US17486430
申请日：2021-09-27
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： CHRISTOPHER M. JAGGERS , CHRISTOPHER M. HELBERG
Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.
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公开(公告)号：US20240114658A1
公开(公告)日：2024-04-04
申请号：US17956799
申请日：2022-09-29
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： CHRISTOPHER M. HELBERG , CHRISTOPHER M. JAGGERS , ROBERT EDWARD RADKE , MUSTANSIR M. PRATAPGARHWALA , MICHAEL J. AUSTIN , SUKESH SHENOY
CPC classification number: H05K7/20336 , G06F1/20 , H05K7/20254 , H05K7/20327 , G06F2200/201
Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.
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公开(公告)号：US20240114657A1
公开(公告)日：2024-04-04
申请号：US17956789
申请日：2022-09-29
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： CHRISTOPHER M. HELBERG , CHRISTOPHER M. JAGGERS , ROBERT EDWARD RADKE
CPC classification number: H05K7/20336 , F25B21/02 , G06F1/206 , H05K7/20154 , H05K7/20254 , H05K7/20327 , H05K7/2039 , F25B2321/023 , F25B2321/0252
Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component, and a second heat transfer element. The apparatus further includes a plurality of thermally conductive paths between the first heat transfer element and the second heat transfer element. Each of the plurality of thermally conductive paths are configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element.
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公开(公告)号：US20240114646A1
公开(公告)日：2024-04-04
申请号：US17956802
申请日：2022-09-29
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： CHRISTOPHER M. JAGGERS , CHRISTOPHER M. HELBERG
CPC classification number: H05K7/20136 , F25B21/02 , G06F1/20 , F25B2321/0251 , G06F2200/201
Abstract: An apparatus for sub-cooling components includes a component cooling device, a processor thermally coupled to the component cooling device, an electronic component, a fan configured to direct an airflow across the processor and the electronic component, and a thermoelectric cooling device thermally coupled to the component cooling device. The thermoelectric cooling device is configured to cool the airflow from a first temperature to a second temperature.
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