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公开(公告)号:US20250076748A1
公开(公告)日:2025-03-06
申请号:US18948779
申请日:2024-11-15
Applicant: AGC Inc.
Inventor: Yusuke ONO , Hiroaki IWAOKA , Taiga FUDETANI
IPC: G03F1/24
Abstract: A reflective mask blank for EUV lithography, includes: a substrate; a conductive film disposed on or above a back surface of the substrate; a reflective layer disposed on or above a front surface of the substrate, the reflective layer reflecting EUV light; and an absorption layer disposed on or above the reflective layer, the absorption layer absorbing the EUV light.
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公开(公告)号:US20240160097A1
公开(公告)日:2024-05-16
申请号:US18544970
申请日:2023-12-19
Applicant: AGC INC.
Inventor: Hiroshi HANEKAWA , Taiga FUDETANI , Yusuke ONO , Shunya TAKI
IPC: G03F1/24
CPC classification number: G03F1/24
Abstract: A reflective mask blank includes: a substrate; a multilayer reflective film configured to reflect EUV light; a protective film; and a phase shift film configured to shift a phase of EUV light, in this order, in which the phase shift film includes a first layer including one or more first elements selected from a group consisting of ruthenium, rhenium, iridium, silver, osmium, gold, palladium, and platinum, and a second layer including one or more second elements selected from a group consisting of tantalum and chromium, the first layer includes a region A1 in which a content of an element having a highest content among the one or more first elements increases in a thickness direction from a side opposite to the second layer toward the second layer, and the region A1 is present adjacent to the second layer.
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公开(公告)号:US20250036020A1
公开(公告)日:2025-01-30
申请号:US18911231
申请日:2024-10-09
Applicant: AGC Inc.
Inventor: Wataru NISHIDA , Daijiro AKAGI , Hiroaki IWAOKA , Hiroshi HANEKAWA , Taiga FUDETANI , Masaru HORI , Takayoshi TSUTSUMI
Abstract: A reflective mask blank includes: a substrate, a multilayer reflective film including molybdenum layers and silicon layers alternately and being configured to reflect EUV light, an intermediate film, a protective film, and an absorber film, in this order, in which the intermediate film includes silicon and nitrogen, an atomic weight ratio of a content of the nitrogen to a content of the silicon is 0.22 to 0.40 or 0.15 or less, the protective film includes one or more layers selected from the group consisting of a layer including rhodium and a layer including a rhodium-containing material, and the rhodium-containing material includes rhodium and one or more elements selected from the group consisting of boron, carbon, nitrogen, oxygen, silicon, titanium, zirconium, niobium, molybdenum, ruthenium, palladium, tantalum, and iridium.
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