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公开(公告)号:US20220371089A1
公开(公告)日:2022-11-24
申请号:US17754125
申请日:2020-09-24
Applicant: Alpha Assembly Solutions Inc.
Inventor: Shamik GHOSHAL , Nirmalya Kumar CHAKI , Remya CHANDRAN , Manoharan VENODH , Bawa SINGH , Barun DAS , Niveditha NAGARAJAN , Rahul RAUT , Oscar KHASELEV , Ranjit PANDHER , Supriya DEVARAJAN , Anubhav RUSTOGI
IPC: B22F7/04 , B22F1/107 , B22F9/30 , H05K1/09 , H05K3/12 , H01B13/012 , H05K3/34 , H01L23/00 , H01B1/02 , B23K35/30
Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.
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公开(公告)号:US20210162496A1
公开(公告)日:2021-06-03
申请号:US17255289
申请日:2019-06-21
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor: Shamik GHOSAL , Remya CHANDRAN , Venodh MANOHARAN , Siuli SARKAR , Bawa SINGH , Rahul RAUT
Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
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