公开(公告)号：US20210283727A1

公开(公告)日：2021-09-16

申请号：US17286704

申请日：2019-10-23

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Rahul RAUT ,  Nirmalyakumar CHAKI ,  Bawa SINGH ,  Ranjit PANDHER ,  Siuli SARKAR

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/362

Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 wt. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.

公开(公告)号：US20240351882A1

公开(公告)日：2024-10-24

申请号：US18664412

申请日：2024-05-15

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Nirmalya Kumar CHAKI ,  Barun DAS ,  Supriya DEVARAJAN ,  Siuli SARKAR ,  Rahul RAUT ,  Bawa SINGH ,  Ranjit PANDHER ,  Oscar KHASELEV

IPC: C01B32/19 ,  C25B1/00 ,  C25B9/00

CPC classification number: C01B32/19 ,  C25B1/00 ,  C25B9/00

Abstract: A method of synthesizing high quality graphene for producing graphene particles and flakes is presented. The engineered qualities of the graphene include size, aspect ratio, edge definition, surface functionalization and controlling the number of layers. Fewer defects are found in the end graphene product in comparison to previous methods. The inventive method of producing graphene is less aggressive, lower cost and more environmentally friendly than previous methods. This method is applicable to both laboratory scale and high volume manufacturing for producing high quality graphene flakes.

公开(公告)号：US20220072664A1

公开(公告)日：2022-03-10

申请号：US17309818

申请日：2019-12-26

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Anil KUMAR ,  Morgana de Avila RIBAS ,  Gyan DUTT ,  Siuli SARKAR ,  Carl BILGRIEN

IPC: B23K35/26 ,  C22C13/00

Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

公开(公告)号：US20240198460A1

公开(公告)日：2024-06-20

申请号：US18555829

申请日：2022-04-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/02 ,  B23K1/19 ,  B23K35/26 ,  B23K35/30

CPC classification number: B23K35/0238 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3093

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

公开(公告)号：US20220371089A1

公开(公告)日：2022-11-24

申请号：US17754125

申请日：2020-09-24

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Remya CHANDRAN ,  Manoharan VENODH ,  Bawa SINGH ,  Barun DAS ,  Niveditha NAGARAJAN ,  Rahul RAUT ,  Oscar KHASELEV ,  Ranjit PANDHER ,  Supriya DEVARAJAN ,  Anubhav RUSTOGI

IPC: B22F7/04 ,  B22F1/107 ,  B22F9/30 ,  H05K1/09 ,  H05K3/12 ,  H01B13/012 ,  H05K3/34 ,  H01L23/00 ,  H01B1/02 ,  B23K35/30

Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

公开(公告)号：US20230374289A1

公开(公告)日：2023-11-23

申请号：US18247996

申请日：2021-10-07

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Bawa SINGH ,  Rahul RAUT ,  Vasuki Srinivas KAUSHIK ,  Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Sandeesh M KUMAR ,  Anubhav RUSTOGI

IPC: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08

CPC classification number: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08 ,  C08L2205/035 ,  C08L2312/00 ,  C08L2201/50 ,  C08L2201/52 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.

公开(公告)号：US20230146579A1

公开(公告)日：2023-05-11

申请号：US17755193

申请日：2020-10-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/30 ,  H01L23/00 ,  B23K1/00 ,  B23K35/40

CPC classification number: B23K35/302 ,  H01L24/29 ,  B23K1/0016 ,  B23K35/404 ,  B23K2101/40

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.