Method of fabricating selectively applied flowable solder joints
    1.
    发明授权
    Method of fabricating selectively applied flowable solder joints 失效
    制造选择性流动的焊接接头的方法

    公开(公告)号:US3849870A

    公开(公告)日:1974-11-26

    申请号:US30649872

    申请日:1972-11-14

    Applicant: AMP INC

    Inventor: COBAUGH R PARMER K

    Abstract: An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shape of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.

    Abstract translation: 公开了一种电气端子结构,其具有粘附到端子的选定部分上的流动沉积量或焊料带,并且被限制在端子的表面上通过存在不可焊接材料而不是必须 触摸终端 还公开了将带状电端子安装在设置在基板中的电镀孔中的方法,其中根据上述应用技术将焊带施加到端子。 还公开了使焊接条平坦化的技术,并且所得到的端接结构具有粘附在其上的扁平焊接带。 焊接带的平坦化有助于通过改变焊接带的形状并通过减少其结构完整性来将带状端子插入电镀孔中,同时产生许多发条断裂。

    Stamped and formed post and miniature spring receptacle
    2.
    发明授权
    Stamped and formed post and miniature spring receptacle 失效
    冲压成型和微型弹簧插头

    公开(公告)号:US3850500A

    公开(公告)日:1974-11-26

    申请号:US28885272

    申请日:1972-09-11

    Applicant: AMP INC

    Inventor: COBAUGH R HEISEY J

    CPC classification number: H01R13/113 H01R4/028 H05K7/1038

    Abstract: A unitary post and receptacle having at least one depending post and spaced longitudinal spring legs. The end portions of the legs are laterally flared and one of the legs is provided with spaced sidewall portions which are parallel or laterally flared. Together, the flared spring legs and sidewall portions define a tapered receptacle extending between the legs. A tab on one of the sidewall portions partially overlies one of the legs.

    Abstract translation: 具有至少一个悬垂和间隔的纵向弹簧腿的整体柱和容座。 腿的端部横向张开,并且腿中的一个设置有平行或侧向张开的间隔开的侧壁部分。 一起,喇叭形的弹簧腿和侧壁部分限定了在腿部之间延伸的锥形容器。 一个侧壁部分上的突片部分地覆盖一条腿。

    Low profile contact for insertion in printed circuit board
    3.
    发明授权
    Low profile contact for insertion in printed circuit board 失效
    印刷电路板上插入的低剖面接触

    公开(公告)号:US3858153A

    公开(公告)日:1974-12-31

    申请号:US39142673

    申请日:1973-08-24

    Applicant: AMP INC

    Inventor: COLLER J COBAUGH R

    CPC classification number: H01R12/58

    Abstract: A low profile contact means stamped from a section of flat stock material and comprising an incomplete cylindrical portion having a C-shaped cross-sectional configuration and further having a flanged portion at one end thereof. A terminal pin extends from the other end of said cylindrical portion. The contact is inserted through an aperture in a printed circuit board with the flanged portion seated on the surface of said circuit board. A tang formed from the cylinder wall extends downwardly into said cylindrical section and towards the gap created by the incomplete cylindrical section. A male pin inserted in said cylindrical section will be pressed by said tang into said gap in said cylindrical section and against the wall of the printed circuit board aperture.

    Abstract translation: 低平面接触装置由平坦材料的一部分冲压而成,并且包括具有C形横截面形状的不完整的圆柱形部分,并且在其一端还具有凸缘部分。 端子销从所述圆柱形部分的另一端延伸。 接触件穿过印刷电路板中的孔插入凸缘部分位于所述电路板的表面上。 从圆筒壁形成的柄向下延伸到所述圆柱形部分中并且朝向由不完整圆柱形部分形成的间隙。 插入所述圆柱形部分中的插销将被所述脚压入所述圆柱形部分的所述间隙并且抵靠印刷电路板孔的壁。

    Spring socket electrical connecting device integral with a carrier strip
    4.
    发明授权
    Spring socket electrical connecting device integral with a carrier strip 失效
    弹簧插座电气连接装置与载体条一体化

    公开(公告)号:US3803537A

    公开(公告)日:1974-04-09

    申请号:US33947573

    申请日:1973-03-08

    Applicant: AMP INC

    Inventor: COBAUGH R SHANNON S

    CPC classification number: H01R12/718

    Abstract: An electrically conducting spring receptacle contained within a cup forms a miniature electrically connecting device in the form of a socket receptacle adapted for mounting within a printed circuit board. A particular feature resides in the socket receptacle fabricated in depending relationship from a carrier strip together with a plurality of similar socket receptacles. These socket receptacles are spaced along a carrier strip in correspondence with the spaces between the corresponding apertures provided in the printed circuit board. The socket receptacles are thereby adapted for simultaneous insertion and mounting within corresponding apertures of the printed circuit board prior to severing the carrier strip from the inserted socket receptacle.

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