公开(公告)号：US3849870A

公开(公告)日：1974-11-26

申请号：US30649872

申请日：1972-11-14

Applicant: AMP INC

Inventor： COBAUGH R ,  PARMER K

IPC: B23K1/20 ,  B23K3/06 ,  H01R4/02 ,  H05K3/34

CPC classification number: B23K1/20 ,  B23K3/0676 ,  B23K2201/36 ,  H01R4/028 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2201/2081 ,  Y10T29/49149

Abstract: An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shape of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.

Abstract translation: 公开了一种电气端子结构，其具有粘附到端子的选定部分上的流动沉积量或焊料带，并且被限制在端子的表面上通过存在不可焊接材料而不是必须 触摸终端 还公开了将带状电端子安装在设置在基板中的电镀孔中的方法，其中根据上述应用技术将焊带施加到端子。 还公开了使焊接条平坦化的技术，并且所得到的端接结构具有粘附在其上的扁平焊接带。 焊接带的平坦化有助于通过改变焊接带的形状并通过减少其结构完整性来将带状端子插入电镀孔中，同时产生许多发条断裂。