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公开(公告)号:US20150194387A1
公开(公告)日:2015-07-09
申请号:US14146895
申请日:2014-01-03
Applicant: Apple Inc.
Inventor: Altan N. Yazar , Kiavash Baratzadeh , Michael J. Reilly , Sean A. Mayo
IPC: H01L23/552 , H05K1/02
CPC classification number: H01L23/552 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06562 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H05K1/0216 , H05K1/0218 , H05K1/0243 , H05K3/3436 , H05K9/0028 , H05K2201/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: This is directed to self-shielded components and methods for making the same. A self-shielded component can include an electromagnetic interference (EMI) shield that contains circuitry within a shielded space defined by the EMI shield. Self-shielding can be achieved by interfacing a conformal shield layer to a ground layer disposed on or within a substrate of the self-shielded component. The combination of the conformal shield layer and the around layer can form a boundary of the shielded space that envelops circuitry requiring shielding. This enables the self-shielded component to be mounted to a circuit board without requiring a shield can or other processing to impart EMI shielding. In addition, the self-shielded components include the benefits of EMI shielding while simultaneously decreasing space requirements.
Abstract translation: 这是针对自屏蔽组件和制作相同的方法。 自屏蔽部件可以包括电磁干扰(EMI)屏蔽,其包含由EMI屏蔽限定的屏蔽空间内的电路。 可以通过将保形屏蔽层接合到设置在自屏蔽部件的基板上或内部的接地层来实现自屏蔽。 共形屏蔽层和周围层的组合可以形成包围需要屏蔽的电路的屏蔽空间的边界。 这使得自屏蔽部件能够安装到电路板,而不需要屏蔽罩或其它处理来施加EMI屏蔽。 此外,自屏蔽组件还包括EMI屏蔽的优点,同时降低了空间要求。
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公开(公告)号:US09455228B2
公开(公告)日:2016-09-27
申请号:US14146895
申请日:2014-01-03
Applicant: Apple Inc.
Inventor: Altan N. Yazar , Kiavash Baratzadeh , Michael J. Reilly , Sean A. Mayo
IPC: H05K9/00 , H01L23/552 , H05K1/02 , H05K3/34 , H01L23/00
CPC classification number: H01L23/552 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06562 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H05K1/0216 , H05K1/0218 , H05K1/0243 , H05K3/3436 , H05K9/0028 , H05K2201/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: This is directed to self-shielded components and methods for making the same. A self-shielded component can include an electromagnetic interference (EMI) shield that contains circuitry within a shielded space defined by the EMI shield. Self-shielding can be achieved by interfacing a conformal shield layer to a ground layer disposed on or within a substrate of the self-shielded component. The combination of the conformal shield layer and the around layer can form a boundary of the shielded space that envelops circuitry requiring shielding. This enables the self-shielded component to be mounted to a circuit board without requiring a shield can or other processing to impart EMI shielding. In addition, the self-shielded components include the benefits of EMI shielding while simultaneously decreasing space requirements.
Abstract translation: 这是针对自屏蔽组件和制作相同的方法。 自屏蔽部件可以包括电磁干扰(EMI)屏蔽,其包含由EMI屏蔽限定的屏蔽空间内的电路。 可以通过将保形屏蔽层与设置在自屏蔽部件的基板上或内部的接地层相接合来实现自屏蔽。 共形屏蔽层和周围层的组合可以形成包围需要屏蔽的电路的屏蔽空间的边界。 这使得自屏蔽部件能够安装到电路板,而不需要屏蔽罩或其它处理来施加EMI屏蔽。 此外,自屏蔽组件还包括EMI屏蔽的优点,同时降低了空间要求。
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公开(公告)号:US20140133174A1
公开(公告)日:2014-05-15
申请号:US13673649
申请日:2012-11-09
Applicant: APPLE INC.
Inventor: Jeremy C. Franklin , Kevin D. Gibbs , Amy Qian , John Raff , Michael J. Reilly , Altan N. Yazar
CPC classification number: F21V9/08 , G02B6/0031 , G02B6/0088 , G02F1/13338 , G02F2001/133317 , G02F2001/133331 , G02F2001/133334 , G02F2202/16 , G02F2202/28 , H05K9/0067
Abstract: Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. A plastic display chassis may be used to support display layers and backlight components. A light blocking material such as a layer of metal or opaque coating material may be formed on a surface of the plastic display chassis and may be used to reduce light leakage from the backlight components to the exterior of the electronic device. A metal barrier structure may be formed on a surface of the support structure and may be used to ground a conductive display layer to a conductive support structure such as a metal display chassis or a metal housing member. The plastic display chassis may be insert molded around a light barrier structure.
Abstract translation: 电子设备可以包括显示器。 显示器可以包括为显示器提供背光照明的背光组件。 背光组件可以包括将来自光源的光分布在显示器上的导光板。 可以使用塑料显示器底盘来支持显示层和背光元件。 可以在塑料显示器底盘的表面上形成诸如金属或不透明涂层材料的遮光材料,并且可以用于减少从背光组件到电子设备外部的光泄漏。 金属阻挡结构可以形成在支撑结构的表面上,并且可以用于将导电显示层接地到诸如金属显示器底座或金属外壳构件的导电支撑结构。 塑料显示器底盘可以围绕光栅结构插入模制。
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