Ring removal from processing chamber

    公开(公告)号:US11101115B2

    公开(公告)日:2021-08-24

    申请号:US16824394

    申请日:2020-03-19

    IPC分类号: H01J37/32 H01L21/687

    摘要: A method and apparatus for replacing process kits that include edge rings and/or support rings in processing chambers. In one implementation, a process kit comprises a multi-segment edge ring. The multi-segment edge ring comprises a first segment, a second segment, and a first annular body. The first annular body comprises a first upper surface, a first lower surface opposite the first upper surface, a first inner surface and a first outer surface. The first segment and the second segment are connectable to form the first annular body. The first lower surface is operable to be positioned over a substrate support disposed within a processing chamber, and at least a portion of the inner surface, which is positioned between the first upper surface and the first lower surface has a diameter greater than a diameter of a substrate to be processed in the processing chamber.

    Long reach vacuum robot with dual wafer pockets

    公开(公告)号:US10710819B1

    公开(公告)日:2020-07-14

    申请号:US16445550

    申请日:2019-06-19

    摘要: A processing system includes a robot arm with an end effector having a longitudinal axis, the robot arm having a reach of at least 45 inches, wherein the end effector includes: a first wafer pocket defined within the end effector at a first location along the longitudinal axis, wherein the first wafer pocket has the reach of at least 45 inches; and a second wafer pocket defined within the end effector at a second location along the longitudinal axis, wherein the second wafer pocket has a second reach that is less than 45 inches. The end effector is capable of concurrently carrying a first wafer in the first wafer pocket and a second wafer in the second wafer pocket.

    OPERATIONS OF ROBOT APPARATUSES WITHIN RECTANGULAR MAINFRAMES

    公开(公告)号:US20230132174A1

    公开(公告)日:2023-04-27

    申请号:US17968870

    申请日:2022-10-19

    IPC分类号: B25J21/00 B25J9/04 B25J11/00

    摘要: A robot apparatus is configured to extend a first end effector into a first process chamber and extend a second end effector into a second process chamber. The first process chamber and the second process chamber are separated by a first pitch. The robot apparatus is further configured to retract the first end effector and the second end effector into a rectangular mainframe while maintaining a distance between the substrates bounded by the first pitch throughout a retraction process, and fold the first end effector and the second end effector inward within a sweep diameter defined by a width of the rectangular mainframe.

    SUBSTRATE PROCESSING SYSTEM CARRIER

    公开(公告)号:US20210292104A1

    公开(公告)日:2021-09-23

    申请号:US17205878

    申请日:2021-03-18

    IPC分类号: B65G47/90 B25J15/08

    摘要: A carrier includes a rigid body forming a plurality of openings and a plurality of fasteners configured to removably attach to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support first content during first transportation of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support second content during second transportation of the carrier within the substrate processing system.