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公开(公告)号：US09597634B2
公开(公告)日：2017-03-21
申请号：US14300372
申请日：2014-06-10
Applicant: APPLIED MATERIALS, INC.
Inventor： Colin John Dickinson , Mehran Moalem , Daniel O. Clark
CPC classification number: B01D53/32 , B01D53/92 , B01D2258/0216 , B01D2259/122 , B01D2259/80 , B01D2259/818 , C23C16/4412
Abstract: Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, an apparatus for treating an exhaust gas in a foreline of a substrate processing system includes a plasma source coupled to a foreline of a process chamber, a reagent source coupled to the foreline upstream of the plasma source, and a foreline gas injection kit coupled to the foreline to controllably deliver a gas to the foreline, wherein the foreline injection kit includes a pressure regulator to set a foreline gas delivery pressure setpoint, and a first pressure gauge coupled to monitor a delivery pressure of the gas.
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公开(公告)号：US10452039B2
公开(公告)日：2019-10-22
申请号：US15663068
申请日：2017-07-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Daniel O. Clark , Youssef A. Loldj , Shaun W. Crawford , Maxime Cayer , Tony H. Tong , Eric Rieske
Abstract: Methods and apparatus for controlling manufacturing equipment are provided herein. In some embodiments, a manufacturing system may include an integrated controller having one or more inputs to receive input values corresponding to operating information of at least one of a process tool, a mass flow controller or at least one sub-fab auxiliary system, wherein the integrated controller is configured to receive the input values, determine that an error condition is matched based on the received input values, and control the at least one sub-fab auxiliary system to operate at a fail-safe operating mode responsive to the determined error condition.
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公开(公告)号：US11110392B2
公开(公告)日：2021-09-07
申请号：US16429357
申请日：2019-06-03
Applicant: APPLIED MATERIALS, INC.
Inventor： Colin John Dickinson , Mehran Moalem , Daniel O. Clark
Abstract: Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, a method for treating an exhaust gas in an exhaust conduit of a substrate processing system includes: flowing an exhaust gas from a process chamber into a plasma source via a foreline; injecting a reagent into the foreline; forming a plasma in the plasma source from the exhaust gas and the reagent; and injecting a cleaning gas into the foreline, wherein the cleaning gas and the reagent are different gases.
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公开(公告)号：US11049735B2
公开(公告)日：2021-06-29
申请号：US15598243
申请日：2017-05-17
Applicant: Applied Materials, Inc.
Inventor： Daniel O. Clark , Phil Chandler , Jay J. Jung
Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode, and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a chamber clean mode. Numerous other embodiments are provided.
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Patent Agency Ranking
公开(公告)号：US10722840B2
公开(公告)日：2020-07-28
申请号：US15449226
申请日：2017-03-03
Applicant: APPLIED MATERIALS, INC.
Inventor： Colin John Dickinson , Mehran Moalem , Daniel O. Clark
Abstract: Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, a method for treating an exhaust gas in an exhaust conduit of a substrate processing system includes: flowing an exhaust gas and a reagent gas into an exhaust conduit of a substrate processing system; injecting a non-reactive gas into the exhaust conduit to maintain a desired pressure in the exhaust conduit for conversion of the exhaust gas; and forming a plasma from the exhaust gas and reagent gas, subsequent to injecting the non-reactive gas, to convert the exhaust gas to abatable byproduct gases.
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公开(公告)号：US20170256425A1
公开(公告)日：2017-09-07
申请号：US15598243
申请日：2017-05-17
Applicant: Applied Materials, Inc.
Inventor： Daniel O. Clark , Phil Chandler , Jay J. Jung
CPC classification number: H01L21/67017 , B01D53/38 , B01D53/74 , C23C14/56 , C23C16/4412 , Y10T137/0318 , Y10T137/0419
Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode, and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a chamber clean mode. Numerous other embodiments are provided.
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公开(公告)号：US09740182B2
公开(公告)日：2017-08-22
申请号：US13895978
申请日：2013-05-16
Applicant: APPLIED MATERIALS, INC.
Inventor： Daniel O. Clark , Youssef A. Loldj , Shaun W. Crawford , Maxime Cayer , Tony H. Tong , Eric Rieske
CPC classification number: G05B15/02 , G05B23/0291 , Y02P90/14 , Y02P90/86
Abstract: Methods and apparatus for controlling manufacturing equipment are provided herein. In some embodiments, a manufacturing system may include an integrated controller having one or more inputs to receive input values corresponding to operating information of at least one of a process tool, a mass flow controller or at least one sub-fab auxiliary system, wherein the integrated controller is configured to receive the input values, determine that an error condition is matched based on the received input values, and control the at least one sub-fab auxiliary system to operate at a fail-safe operating mode responsive to the determined error condition.
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公开(公告)号：US09685352B2
公开(公告)日：2017-06-20
申请号：US14610301
申请日：2015-01-30
Applicant: Applied Materials, Inc.
Inventor： Daniel O. Clark , Phil Chandler , Jay J. Jung
CPC classification number: H01L21/67017 , B01D53/38 , B01D53/74 , C23C14/56 , C23C16/4412 , Y10T137/0318 , Y10T137/0419
Abstract: An electronic device manufacturing system is provided that may reduce the amount of resources used in electronic device manufacturing processes. In some embodiments, unreacted ozone exiting a process tool operating in an ozone mode may be diverted and used as an oxidant in an abatement tool when the process tool is operating in a non-ozone mode. Numerous other embodiments are provided.
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9.发明申请METHODS AND APPARATUS FOR CONSERVING ELECTRONIC DEVICE MANUFACTURING RESOURCES 审中-公开保护电子设备制造资源的方法和装置公开(公告)号：US20150136239A1
公开(公告)日：2015-05-21
申请号：US14610301
申请日：2015-01-30
Applicant: Applied Materials, Inc.
Inventor： Daniel O. Clark , Phil Chandler , Jay J. Jung
CPC classification number: H01L21/67017 , B01D53/38 , B01D53/74 , C23C14/56 , C23C16/4412 , Y10T137/0318 , Y10T137/0419
Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode; and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a clean mode. Numerous other embodiments are provided.
Abstract translation: 提供了一种用于操作电子装置制造系统的方法，其包括在处理工具以工艺模式运行时以惰性气体以第一流量引入惰性气体; 并且在处理工具以清洁模式操作时，以第二流量将惰性气体引入过程工具真空泵。 提供了许多其他实施例。
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