公开(公告)号：US20150155407A1

公开(公告)日：2015-06-04

申请号：US14557696

申请日：2014-12-02

Applicant: APPLIED MATERIALS, INC.

Inventor： LANCE A. SCUDDER ,  CHARLES GAY ,  JAMES M. GEE ,  KASHIF MAQSOOD ,  BRIAN H. BURROWS ,  TAEJOON PARK

IPC: H01L31/0475 ,  B32B38/10 ,  B32B43/00 ,  B32B37/18

CPC classification number: B32B43/006 ,  B32B38/06 ,  H01L31/02363 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: Methods for processing substrates are provided herein. In some embodiments, the method includes providing a substrate supported on a starting template; adhering a first superstrate to a first side of the substrate; separating the substrate with the superstrate from the starting template; determining if a useful life of the used template has been reached; and re-using the used template as a starting template if the useful life has not been reached.

Abstract translation: 本文提供了处理基板的方法。 在一些实施方案中，该方法包括提供支撑在起始模板上的底物; 将第一顶板粘附到所述基板的第一侧; 将底物与起始模板分离; 确定是否已经达到使用的模板的使用寿命; 并且如果尚未达到使用寿命，则将所使用的模板重新使用为起始模板。

公开(公告)号：US20170244006A1

公开(公告)日：2017-08-24

申请号：US15506133

申请日：2015-09-01

Applicant: APPLIED MATERIALS, INC.

Inventor： BRIAN H. BURROWS ,  NILESH BAGUL ,  SUMEDH ACHARYA ,  BAHUBALI UPADHYE ,  LANCE A. SCUDDER ,  ROGER N. ANDERSON

IPC: H01L31/18 ,  H01L21/673 ,  C23C16/54 ,  C23C16/458 ,  C23C16/455 ,  H01L21/67 ,  C23C16/44

CPC classification number: H01L31/1876 ,  C23C16/4408 ,  C23C16/45519 ,  C23C16/45523 ,  C23C16/4585 ,  C23C16/4586 ,  C23C16/4587 ,  C23C16/481 ,  C23C16/54 ,  H01L21/67115 ,  H01L21/67173 ,  H01L21/67326 ,  H01L21/6773 ,  H01L31/18 ,  Y02E10/50 ,  Y02P70/521

Abstract: In some embodiments, an inline substrate processing tool may include a substrate carrier having a plurality of slots configured to retain a plurality of substrates parallel to each other when disposed in the slots, a first substrate processing module and a second substrate processing module disposed in a linear arrangement, wherein each substrate processing module includes an enclosure and a track that supports the substrate carrier and provides a path for the substrate carrier to move linearly through the first and second substrate processing modules, and a first gas cap disposed between the first and second substrate processing modules, wherein the first gas cap includes a first process gas conduit to provide a first process gas to the first substrate processing module, and a second process gas conduit to provide a second process gas to the second substrate processing module.