公开(公告)号：US20170244006A1

公开(公告)日：2017-08-24

申请号：US15506133

申请日：2015-09-01

Applicant: APPLIED MATERIALS, INC.

Inventor： BRIAN H. BURROWS ,  NILESH BAGUL ,  SUMEDH ACHARYA ,  BAHUBALI UPADHYE ,  LANCE A. SCUDDER ,  ROGER N. ANDERSON

IPC: H01L31/18 ,  H01L21/673 ,  C23C16/54 ,  C23C16/458 ,  C23C16/455 ,  H01L21/67 ,  C23C16/44

CPC classification number: H01L31/1876 ,  C23C16/4408 ,  C23C16/45519 ,  C23C16/45523 ,  C23C16/4585 ,  C23C16/4586 ,  C23C16/4587 ,  C23C16/481 ,  C23C16/54 ,  H01L21/67115 ,  H01L21/67173 ,  H01L21/67326 ,  H01L21/6773 ,  H01L31/18 ,  Y02E10/50 ,  Y02P70/521

Abstract: In some embodiments, an inline substrate processing tool may include a substrate carrier having a plurality of slots configured to retain a plurality of substrates parallel to each other when disposed in the slots, a first substrate processing module and a second substrate processing module disposed in a linear arrangement, wherein each substrate processing module includes an enclosure and a track that supports the substrate carrier and provides a path for the substrate carrier to move linearly through the first and second substrate processing modules, and a first gas cap disposed between the first and second substrate processing modules, wherein the first gas cap includes a first process gas conduit to provide a first process gas to the first substrate processing module, and a second process gas conduit to provide a second process gas to the second substrate processing module.

公开(公告)号：US20160298263A1

公开(公告)日：2016-10-13

申请号：US15092875

申请日：2016-04-07

Applicant: APPLIED MATERIALS, INC.

Inventor： DAVID MASAYUKI ISHIKAWA ,  PAUL J. STEFFAS ,  SUMEDH ACHARYA ,  BRIAN H. BURROWS

IPC: C30B25/22 ,  H01L21/02 ,  H01L21/67 ,  C30B29/06 ,  C30B25/12 ,  C30B25/14 ,  C30B25/10 ,  H01L31/18 ,  H01L21/687

CPC classification number: C30B25/22 ,  C23C16/45502 ,  C23C16/45512 ,  C23C16/4557 ,  C23C16/46 ,  C30B25/10 ,  C30B25/12 ,  C30B25/14 ,  C30B29/06 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/68771 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: In some embodiments, an substrate processing system may include a chamber body, a heater assembly disposed within the chamber body, wherein the heater assembly includes a plurality of resistive heater elements coupled together to form an isothermal heated enclosure, and a process kit disposed within the isothermal heated enclosure and having an inner processing volume that includes a plurality of substrate supports to support substrates when disposed thereon, wherein the process kit includes a first processing gas inlet to provide processing gases to the inner processing volume, a first carrier gas inlet to provide a carrier gas to the inner processing volume, and a first exhaust outlet, and a first gas heater coupled via a first conduit to the first carrier gas inlet to heat the carrier gas prior to flowing into the inner processing volume.

Abstract translation: 在一些实施例中，衬底处理系统可以包括室主体，设置在室主体内的加热器组件，其中加热器组件包括耦合在一起以形成等温加热外壳的多个电阻加热器元件，以及设置在室主体内的处理套件 等温加热的外壳并且具有内部处理体积，其包括多个基板支撑件，以在其上设置时支撑基板，其中所述处理套件包括用于向内部处理体积提供处理气体的第一处理气体入口，第一载气入口，以提供 到内部处理体积的载气和第一排气出口，以及经由第一导管连接到第一载气入口的第一气体加热器，以在流入内部处理容积之前加热载气。