METHODS FOR SUBSTRATE PROCESSING
    1.
    发明申请
    METHODS FOR SUBSTRATE PROCESSING 审中-公开
    基板处理方法

    公开(公告)号:US20150155407A1

    公开(公告)日:2015-06-04

    申请号:US14557696

    申请日:2014-12-02

    Abstract: Methods for processing substrates are provided herein. In some embodiments, the method includes providing a substrate supported on a starting template; adhering a first superstrate to a first side of the substrate; separating the substrate with the superstrate from the starting template; determining if a useful life of the used template has been reached; and re-using the used template as a starting template if the useful life has not been reached.

    Abstract translation: 本文提供了处理基板的方法。 在一些实施方案中,该方法包括提供支撑在起始模板上的底物; 将第一顶板粘附到所述基板的第一侧; 将底物与起始模板分离; 确定是否已经达到使用的模板的使用寿命; 并且如果尚未达到使用寿命,则将所使用的模板重新使用为起始模板。

    DOORS FOR HIGH VOLUME, LOW COST SYSTEM FOR EPITAXIAL SILICON DEPOSITION
    2.
    发明申请
    DOORS FOR HIGH VOLUME, LOW COST SYSTEM FOR EPITAXIAL SILICON DEPOSITION 审中-公开
    用于外源硅沉积的高体积,低成本体系的门

    公开(公告)号:US20140060435A1

    公开(公告)日:2014-03-06

    申请号:US13721332

    申请日:2012-12-20

    Abstract: Apparatus for use in an inline substrate processing tool are provided herein. In some embodiments, a door for use in an inline substrate processing tool between a first and a second substrate processing module coupled to one another in a linear arrangement may include a reflective body disposed between two cover plates of substantially transparent material, configured to reflect light and heat energy into each of the at first and second substrate processing modules, wherein the door is selectively movable, via an actuator coupled to the door, between an open position that fluidly couples the first and second substrate processing modules to a closed position that isolates the first substrate processing module from the second substrate processing module.

    Abstract translation: 本文提供了用于在线基板处理工具中的装置。 在一些实施例中,在线性布置中彼此耦合的第一和第二基板处理模块之间的在线基板处理工具中使用的门可以包括设置在基本透明材料的两个盖板之间的反射体, 并且将热能分配到每个第一和第二基板处理模块中,其中门可选择性地通过耦合到门的致动器在将第一和第二基板处理模块流体耦合到打开位置之间选择性地移动,该打开位置将隔离 来自第二基板处理模块的第一基板处理模块。

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