公开(公告)号：US20190259562A1

公开(公告)日：2019-08-22

申请号：US16405377

申请日：2019-05-07

Applicant: APPLIED MATERIALS, INC.

Inventor： LEONID DORF ,  TRAVIS KOH ,  OLIVIER LUERE ,  OLIVIER JOUBERT ,  PHILIP A. KRAUS ,  RAJINDER DHINDSA ,  JAMES ROGERS

IPC: H01J37/08 ,  H01J37/248

Abstract: Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse-bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.

公开(公告)号：US20210343496A1

公开(公告)日：2021-11-04

申请号：US17377639

申请日：2021-07-16

Applicant: APPLIED MATERIALS, INC.

Inventor： LEONID DORF ,  TRAVIS KOH ,  OLIVIER LUERE ,  OLIVIER JOUBERT ,  PHILIP A. KRAUS ,  RAJINDER DHINDSA ,  JAMES ROGERS

IPC: H01J37/08 ,  H01J37/248 ,  H01J37/32

Abstract: Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse-bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.

公开(公告)号：US20200266022A1

公开(公告)日：2020-08-20

申请号：US16867034

申请日：2020-05-05

Applicant: APPLIED MATERIALS, INC.

Inventor： LEONID DORF ,  TRAVIS KOH ,  OLIVIER LUERE ,  OLIVIER JOUBERT ,  PHILIP A. KRAUS ,  RAJINDER DHINDSA ,  JAMES ROGERS

IPC: H01J37/08 ,  H01J37/32 ,  H01J37/248

Abstract: Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse—bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.