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公开(公告)号：US11195267B1
公开(公告)日：2021-12-07
申请号：US16926395
申请日：2020-07-10
发明人： Harel Ilan , Doron Korngut , Ori Golani , Ido Almog
摘要： Disclosed herein is a computerized system including scanning equipment configured to obtain multi-perspective scan data of a slice on a sample. The scanning equipment includes: (i) a light source configured to generate a light beam; (ii) an acousto-optic deflector (AOD) configured to focus the light beam such as to generate a beam train scanned along consecutive lines on the slice, in groups of n≥2 successively scanned lines, along each of which the beam train forms at least one illumination spot, respectively; and (iii) one or more detectors configured to sense light returned from the slice. The n≥2 lines are scanned different perspectives, respectively. The consecutive lines may be longitudinally displaced relative to one another, such as to overlap in 100·(n−1)/n % of widths thereof, so that the slice may be fully scanned in each of the perspectives.
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公开(公告)号：US09835563B2
公开(公告)日：2017-12-05
申请号：US14946693
申请日：2015-11-19
发明人： Yoram Uziel , Ron Naftali , Ofer Adan , Haim Feldman , Ofer Shneyour , Ron Bar-Or , Doron Korngut
摘要： There may be provided an evaluation system that may include spatial sensors that include atomic force microscopes (AFMs) and a solid immersion lens. The AFMs are arranged to generate spatial relationship information that is indicative of a spatial relationship between the solid immersion lens and a substrate. The controller is arranged to receive the spatial relationship information and to send correction signals to the at least one location correction element for introducing a desired spatial relationship between the solid immersion lens and the substrate.
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公开(公告)号：US20220012862A1
公开(公告)日：2022-01-13
申请号：US16923882
申请日：2020-07-08
发明人： Doron Korngut , Ido Almog
摘要： Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives, and (ii) analyzing scan data of a last scanned page while scanning a next page from the plurality of pages. At least some of the pages include multiple slices of the wafer. The analysis of the scan data includes identifying defects in the scanned pages, based on an integrated analysis combining scan data from each of the multiplicity of perspectives. Further disclosed is a computerized system configured to implement the method.
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公开(公告)号：US10446434B2
公开(公告)日：2019-10-15
申请号：US15134306
申请日：2016-04-20
发明人： Doron Korngut , Yuri Belenky , Yoram Uziel , Ron Naftali , Ron Bar-or , Yuval Gronau
IPC分类号： B25B1/00 , H01L21/687 , H01L21/67 , B25B11/02 , B32B38/18 , B25B1/24 , B23B31/08 , B32B37/00
摘要： According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.
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公开(公告)号：US11250560B2
公开(公告)日：2022-02-15
申请号：US16923882
申请日：2020-07-08
发明人： Doron Korngut , Ido Almog
摘要： Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives, and (ii) analyzing scan data of a last scanned page while scanning a next page from the plurality of pages. At least some of the pages include multiple slices of the wafer. The analysis of the scan data includes identifying defects in the scanned pages, based on an integrated analysis combining scan data from each of the multiplicity of perspectives. Further disclosed is a computerized system configured to implement the method.
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公开(公告)号：US20170309511A1
公开(公告)日：2017-10-26
申请号：US15134306
申请日：2016-04-20
发明人： Doron Korngut , Yuri Belenky , Yoram Uziel , Ron Naftali , Ron Bar-or , Yuval Gronau
IPC分类号： H01L21/687
CPC分类号： H01L21/68785 , B23B31/08 , B25B1/2484 , B25B11/02 , B32B37/0046 , B32B38/1833 , H01L21/67092 , H01L21/67288 , H01L21/68735 , H01L21/68742 , H01L21/68764
摘要： According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.
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