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公开(公告)号：US11276545B1
公开(公告)日：2022-03-15
申请号：US17131666
申请日：2020-12-22
发明人： Yosef Basson , Yuri Belenky , Mordechai Rozen , Lior Klein , Asaf Grosz
IPC分类号： H01J37/09 , H01J37/244 , H01J37/28
摘要： A method, a non-transitory computer readable medium and a system for compensating for an electromagnetic interference induced deviation of an electron beam. The method may include obtaining measurement information about a magnetic field within an electron beam tool, the measurement information is generated by at least one planar Hall Effect magnetic sensor that is located within the electron beam tool; wherein the at least one planar Hall Effect magnetic sensor comprises at least one magnetometer integrated with at least one magnetic flux concentrator; estimating the electromagnetic interference induced deviation of the electron beam, the estimating is based on the magnetic field; and setting a trajectory of the electron beam to compensate for the electromagnetic interference induced deviation of the electron beam.
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公开(公告)号：US10446434B2
公开(公告)日：2019-10-15
申请号：US15134306
申请日：2016-04-20
发明人： Doron Korngut , Yuri Belenky , Yoram Uziel , Ron Naftali , Ron Bar-or , Yuval Gronau
IPC分类号： B25B1/00 , H01L21/687 , H01L21/67 , B25B11/02 , B32B38/18 , B25B1/24 , B23B31/08 , B32B37/00
摘要： According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.
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公开(公告)号：US20170309511A1
公开(公告)日：2017-10-26
申请号：US15134306
申请日：2016-04-20
发明人： Doron Korngut , Yuri Belenky , Yoram Uziel , Ron Naftali , Ron Bar-or , Yuval Gronau
IPC分类号： H01L21/687
CPC分类号： H01L21/68785 , B23B31/08 , B25B1/2484 , B25B11/02 , B32B37/0046 , B32B38/1833 , H01L21/67092 , H01L21/67288 , H01L21/68735 , H01L21/68742 , H01L21/68764
摘要： According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.
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公开(公告)号：US20170084425A1
公开(公告)日：2017-03-23
申请号：US15371332
申请日：2016-12-07
发明人： Yoram Uziel , Benzion Sender , Doron Aspir , Yohanan Madmon , Ron Naftali , Yuri Belenky
CPC分类号： H01J37/28 , G06T7/0004 , G06T2207/30148 , H01J37/20 , H01J2237/20228 , H01J2237/2817
摘要： A method for scanning an object, the method may include moving an object by a first mechanical stage that follows a first scan pattern; introducing multiple movements, by a second mechanical stage, between the object and the first mechanical stage while the first mechanical stage follows the first scan pattern; and obtaining, by optics, images of multiple suspected defects while the first mechanical stage follows the first scan pattern; wherein a weight of the first mechanical stage exceeds a weight of the second mechanical stage.
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公开(公告)号：US10068748B2
公开(公告)日：2018-09-04
申请号：US15371332
申请日：2016-12-07
发明人： Yoram Uziel , Benzion Sender , Doron Aspir , Yohanan Madmon , Ron Naftali , Yuri Belenky
CPC分类号： H01J37/28 , G06T7/0004 , G06T2207/30148 , H01J37/20 , H01J2237/20228 , H01J2237/2817
摘要： A method for scanning an object, the method may include moving an object by a first mechanical stage that follows a first scan pattern; introducing multiple movements, by a second mechanical stage, between the object and the first mechanical stage while the first mechanical stage follows the first scan pattern; and obtaining, by optics, images of multiple suspected defects while the first mechanical stage follows the first scan pattern; wherein a weight of the first mechanical stage exceeds a weight of the second mechanical stage.
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