公开(公告)号：US09831392B2

公开(公告)日：2017-11-28

申请号：US15171051

申请日：2016-06-02

Applicant: Asahi Glass Company, Limited

Inventor： Makoto Shiratori ,  Yoko Mitsui ,  Satoshi Takeda

IPC: H01L33/48 ,  C03C3/091 ,  C03C3/093 ,  C03C3/11 ,  C03C8/24 ,  H01L33/56 ,  H01L33/32 ,  H01L33/50

CPC classification number: H01L33/483 ,  C03C3/091 ,  C03C3/093 ,  C03C3/11 ,  C03C8/24 ,  H01L33/32 ,  H01L33/507 ,  H01L33/56 ,  H01L2924/16195 ,  H01L2933/0033

Abstract: To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long period of time, and a light emitting device. The cover glass for light emitting diode package has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO2, from 0.5 to 15% of Al2O3, from 5 to 25% of B2O3, from 0 to 7% of Li2O, from 0 to 15% of Na2O, from 0 to 10% of K2O (provided Li2O+Na2O+K2O=from 2 to 20%), from 0 to 0.1% of SnO2 and from 0.001 to 0.1% of Fe2O3, it does not substantially contain As2O3, Sb2O3 and PbO, and it has an average thermal expansion coefficient of from 45 to 70×10−7/° C. in a temperature range of from 0 to 300° C.

公开(公告)号：US20130164486A1

公开(公告)日：2013-06-27

申请号：US13716812

申请日：2012-12-17

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Kazuo YAMADA ,  Motoshi Ono ,  Mitsuru Watanabe ,  Toshihiro Takeuchi ,  Satoshi Takeda

IPC: C03C27/06

CPC classification number: C03C8/24 ,  C03C8/04 ,  C03C27/06 ,  G02F1/1303 ,  G02F1/1339 ,  H01J9/261 ,  H01J11/48 ,  H01J2211/48 ,  H01J2329/867 ,  H01J2329/8675 ,  Y10T428/239

Abstract: Provided is an electronic device wherein at a time of laser-sealing a space between two glass substrates, it is possible to suppress generation of a crack or a breakage etc. in the glass substrates or a sealing layer. When a cross-section of the sealing layer 6 of the electronic device is observed, the sum total of perimeter lengths of the low expansion filler and the laser absorbent present in a unit area (fluidity inhibition value) is from 0.7 to 1.3 μm−1, and the sum total (thermal expansion value) of a value obtained by multiplying the area ratio of the sealing glass by the thermal expansion coefficient, and a value obtained by multiplying the sum total of the area ratios of the low expansion filler and the laser absorbent by the thermal expansion coefficient of the low expansion filler, is from 50 to 90×10−7/° C.

Abstract translation: 提供一种电子设备，其中在激光密封两个玻璃基板之间的空间的时候，可以抑制玻璃基板或密封层中的裂纹或断裂等的产生。 当观察到电子装置的密封层6的横截面时，单位面积内存在的低膨胀填料和激光吸收剂的周长的总和（流动性抑制值）为0.7〜1.3μm-1 ，并且通过将密封玻璃的面积比乘以热膨胀系数而获得的值的总和（热膨胀值）与通过将低膨胀填料和激光的面积比的总和相乘得到的值 通过低膨胀填料的热膨胀系数吸收，为50〜90×10-7 /℃。