公开(公告)号：US09629250B2

公开(公告)日：2017-04-18

申请号：US14679237

申请日：2015-04-06

Applicant: Asahi Glass Company, Limited

Inventor： Shintaro Takahashi ,  Motoshi Ono

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03 ,  C03C15/00 ,  C03C23/00

CPC classification number: H05K3/007 ,  C03C15/00 ,  C03C23/0025 ,  C03C27/00 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/10378

Abstract: A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 μm, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 μm and 80 μm, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.

公开(公告)号：US20130301127A1

公开(公告)日：2013-11-14

申请号：US13946670

申请日：2013-07-19

Applicant: Asahi Glass Company, Limited

Inventor： Gousuke Yoshida ,  Motoshi Ono ,  Mitsuru Watanabe

IPC: G02B5/30 ,  C03C23/00

CPC classification number: G02B5/3083 ,  C03C23/0025

Abstract: To provide a low-cost wave plate that does not cause any diffracted light and wavefront aberrations. The challenge is met by providing a wave plate characterized by including a first region, a second region, and a third region which are placed on a glass substrate. The first region and the second region exhibit each uniaxial birefringence at least in their portions. The third region exhibits uniaxial birefringence and is interposed between the first region and the second region. Phase advance axes of birefringence of the first region and the second region are substantially parallel to each other. A phase advance axis of birefringence of the third region is substantially orthogonal to the phase advance axes of birefringence of the first and second regions.

Abstract translation: 提供不会引起任何衍射光和波前像差的低成本波片。 通过提供一种特征在于包括放置在玻璃基板上的第一区域，第二区域和第三区域的波片来满足挑战。 第一区域和第二区域至少在其部分表现出单轴双折射。 第三区域显示单轴双折射并且介于第一区域和第二区域之间。 第一区域和第二区域的双折射的相位前进轴线基本上彼此平行。 第三区域的双折射的相位提前轴基本上与第一和第二区域的双折射相位超前轴正交。

公开(公告)号：US20180339936A1

公开(公告)日：2018-11-29

申请号：US15989934

申请日：2018-05-25

Applicant: Asahi Glass Company, Limited

Inventor： Motoshi Ono ,  Mamoru Isobe ,  Shigetoshi Mori ,  Kohei Horiuchi

IPC: C03C15/00 ,  H05K3/00 ,  C03C23/00 ,  B23K26/00 ,  B23K26/382

Abstract: A manufacturing method of a glass substrate having through holes includes (i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and (ii) performing a wet etching treatment on the glass substrate. During the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of the wet etching period, referred to as an ultrasonic vibration application period.

公开(公告)号：US20160347643A1

公开(公告)日：2016-12-01

申请号：US15162040

申请日：2016-05-23

Applicant: Asahi Glass Company, Limited

Inventor： Hiroyuki YAMAUCHI ,  Go Takahashi ,  Motoshi Ono ,  Mamoru Isobe

IPC: C03B33/09 ,  H01L21/48 ,  C03C15/00

CPC classification number: H01L21/486 ,  B23K26/382 ,  B23K2103/54 ,  C03C15/00 ,  H01L23/15

Abstract: There is provided a glass substrate manufacturing method for manufacturing a glass substrate with a plurality of through-holes. The method includes a laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant only from a position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate.

Abstract translation: 提供了一种用于制造具有多个通孔的玻璃基板的玻璃基板的制造方法。 该方法包括在玻璃基板中形成多个通孔的激光加工，玻璃基板具有通过向第一主表面照射激光束而具有面向第一主表面的第一主表面和第二主表面; 以及仅从玻璃基板的第二主表面朝向形成在玻璃基板上的多个通孔的位置注入蚀刻剂的蚀刻工序。

公开(公告)号：US09688563B2

公开(公告)日：2017-06-27

申请号：US15057605

申请日：2016-03-01

Applicant: Asahi Glass Company, Limited

Inventor： Motoshi Ono ,  Takanori Kobashi

IPC: C03B33/10 ,  B26D7/01 ,  C03B33/023

CPC classification number: B23K26/384 ,  B26D7/01 ,  B26D7/20

Abstract: An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 μm.

公开(公告)号：US20130034687A1

公开(公告)日：2013-02-07

申请号：US13650218

申请日：2012-10-12

Applicant: Asahi Glass Company, Limited

Inventor： Akio KOIKE ,  Motoshi Ono ,  Ryota Murakami ,  Shinya Kikugawa

IPC: C03C3/076 ,  B32B3/24

CPC classification number: H01L23/15 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  C03C3/091 ,  C03C3/093 ,  H01L23/49827 ,  H01L2924/0002 ,  Y10T428/24273 ,  H01L2924/00

Abstract: A glass substrate for forming a through-substrate via of a semiconductor device includes a plurality of penetration holes. In the glass substrate, an α-count is 0.05 c/cm2·h or less, a SiO2 content is 40 wt % or higher, a sum total content of Li2O (wt %)+Na2O (wt %)+K2O (Wt%) is 6.0 wt % or lower, and an average coefficient of thermal expansion at 50° C. to 350° C. is in a range of 20×10−7/K to 40×10−7/K.

Abstract translation: 用于形成半导体器件的贯通基板通孔的玻璃基板包括多个贯通孔。 在玻璃基板中，α计数为0.05c / cm 2·h以下，SiO 2含量为40重量％以上，Li 2 O（wt％）+ Na 2 O（wt％）+ K 2 O（Wt％ ）为6.0重量％以下，在50℃〜350℃的平均热膨胀系数在20×10-7 / K〜40×10-7 / K的范围内。

公开(公告)号：US20130187141A1

公开(公告)日：2013-07-25

申请号：US13790582

申请日：2013-03-08

Applicant: Asahi Glass Company, Limited

Inventor： Nobuhiro NAKAMURA ,  Tomohiro Yamada ,  Motoshi Ono ,  Nao Ishibashi ,  Susumu Suzuki

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/5275 ,  H01L51/0096 ,  H01L51/5215 ,  H01L51/5268 ,  H01L51/56 ,  H05B33/10 ,  H05B33/24 ,  Y02E10/549 ,  Y02P70/521

Abstract: An organic EL element includes a transparent substrate; a first electrode; an organic light emitting layer formed on the first electrode; and a second electrode formed on the organic light emitting layer, wherein a scattering layer including a base material made of glass and scattering substances dispersed in the base material is provided on the transparent substrate, and a light extraction assistance layer is provided between the scattering layer and the first electrode, the light extraction assistance layer being made of an inorganic material other than glass.

Abstract translation: 有机EL元件包括透明基板; 第一电极; 形成在所述第一电极上的有机发光层; 以及在所述有机发光层上形成的第二电极，其中，在所述透明基板上设置包括由玻璃制成的基材的散射层和分散在所述基材中的散射物质，并且在所述散射层 并且第一电极，光提取辅助层由玻璃以外的无机材料制成。

公开(公告)号：US20130164486A1

公开(公告)日：2013-06-27

申请号：US13716812

申请日：2012-12-17

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Kazuo YAMADA ,  Motoshi Ono ,  Mitsuru Watanabe ,  Toshihiro Takeuchi ,  Satoshi Takeda

IPC: C03C27/06

CPC classification number: C03C8/24 ,  C03C8/04 ,  C03C27/06 ,  G02F1/1303 ,  G02F1/1339 ,  H01J9/261 ,  H01J11/48 ,  H01J2211/48 ,  H01J2329/867 ,  H01J2329/8675 ,  Y10T428/239

Abstract: Provided is an electronic device wherein at a time of laser-sealing a space between two glass substrates, it is possible to suppress generation of a crack or a breakage etc. in the glass substrates or a sealing layer. When a cross-section of the sealing layer 6 of the electronic device is observed, the sum total of perimeter lengths of the low expansion filler and the laser absorbent present in a unit area (fluidity inhibition value) is from 0.7 to 1.3 μm−1, and the sum total (thermal expansion value) of a value obtained by multiplying the area ratio of the sealing glass by the thermal expansion coefficient, and a value obtained by multiplying the sum total of the area ratios of the low expansion filler and the laser absorbent by the thermal expansion coefficient of the low expansion filler, is from 50 to 90×10−7/° C.

Abstract translation: 提供一种电子设备，其中在激光密封两个玻璃基板之间的空间的时候，可以抑制玻璃基板或密封层中的裂纹或断裂等的产生。 当观察到电子装置的密封层6的横截面时，单位面积内存在的低膨胀填料和激光吸收剂的周长的总和（流动性抑制值）为0.7〜1.3μm-1 ，并且通过将密封玻璃的面积比乘以热膨胀系数而获得的值的总和（热膨胀值）与通过将低膨胀填料和激光的面积比的总和相乘得到的值 通过低膨胀填料的热膨胀系数吸收，为50〜90×10-7 /℃。

公开(公告)号：US20130034688A1

公开(公告)日：2013-02-07

申请号：US13650391

申请日：2012-10-12

Applicant: Asahi Glass Company, Limited

Inventor： Akio Koike ,  Motoshi Ono ,  Ryota Murakami ,  Shinya Kikugawa

IPC: B32B3/24 ,  B32B17/06

CPC classification number: H01L23/15 ,  H01L21/4807 ,  H01L23/49827 ,  H01L2924/0002 ,  Y10T428/24273 ,  Y10T428/24298 ,  H01L2924/00

Abstract: A glass substrate for forming a through-substrate via of a semiconductor device includes a first surface and a second surface, and penetration holes extending from the first surface to the second surface, wherein at least one of the first and second surfaces is chemically strengthened.

Abstract translation: 用于形成半导体器件的通孔的玻璃基板包括第一表面和第二表面，以及从第一表面延伸到第二表面的穿透孔，其中第一表面和第二表面中的至少一个被化学强化。