LIQUID LEVEL SENSOR FOR A CHEMICAL SOURCE VESSEL

    公开(公告)号:US20210041284A1

    公开(公告)日:2021-02-11

    申请号:US16944763

    申请日:2020-07-31

    Abstract: A chemical vessel used for holding a liquid chemical precursor is disclosed comprising a liquid level sensor tube. The liquid level sensor tube is configured to operate in an environment where the liquid chemical precursor is heated to a point of boiling or vaporization. The liquid level sensor tube comprises housing with a slot built in to prevent any false readings of sensors disposed within the liquid level sensor tube.

    METHODS AND APPARATUS FOR HEATING A LIQUID
    3.
    发明公开

    公开(公告)号:US20240301980A1

    公开(公告)日:2024-09-12

    申请号:US18665202

    申请日:2024-05-15

    CPC classification number: F16L53/38 H01L21/67023 C23C16/45561 Y10T137/6416

    Abstract: An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.

    METHODS AND APPARATUS FOR HEATING A LIQUID

    公开(公告)号:US20230091275A1

    公开(公告)日:2023-03-23

    申请号:US17944296

    申请日:2022-09-14

    Abstract: An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.

    System and apparatus for a valve assembly

    公开(公告)号:US12224190B2

    公开(公告)日:2025-02-11

    申请号:US18539754

    申请日:2023-12-14

    Abstract: A valve assembly may provide a body comprising a bottom portion and a top portion having a threaded region, a closing mechanism situated above the top portion of the body, an actuator in communication with the closing mechanism, a nut configured to attach to the threaded region, and a threaded hole extending into at least one of the bottom portion of the body or the nut.

    Methods and apparatus for heating a liquid

    公开(公告)号:US11988316B2

    公开(公告)日:2024-05-21

    申请号:US17944296

    申请日:2022-09-14

    CPC classification number: F16L53/38 H01L21/67023 C23C16/45561 Y10T137/6416

    Abstract: An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.

Patent Agency Ranking