公开(公告)号：US09349620B2

公开(公告)日：2016-05-24

申请号：US14327134

申请日：2014-07-09

Applicant: ASM IP Holding B.V.

Inventor： Keisuke Kamata ,  Hiroyuki Sato ,  Kazunori Furukawahara ,  Masaei Suwada ,  Kenkichi Okubo ,  Izumi Arai

IPC: F26B11/00 ,  H01L21/67 ,  H01L21/677 ,  F27B9/12

CPC classification number: H01L21/67109 ,  F27B17/0025 ,  F27B2009/124 ,  H01L21/67775 ,  H01L21/67778

Abstract: A pre-baking apparatus for heating a substrate upstream of a process tool is adapted to be connected to an EFEM (equipment front end module) and includes: a chamber which has a front face with multiple slots arranged in a height direction of the chamber, and which is divided into multiple compartments extending from the multiple slots, respectively, toward a rear end of the chamber for loading and unloading substrates; and a connecting frame for connecting the chamber to the process tool. The multiple compartments are separated from each other by a divider plate and provided with heaters for heating the multiple compartments, and each compartment has a gas injection port for blowing a hot inert gas over the substrate placed therein toward the slot.

Abstract translation: 用于加热处理工具上游的基板的预烘烤装置适于连接到EFEM（设备前端模块），并且包括：具有在室的高度方向上布置有多个槽的前表面的室， 并且其分成多个隔室，分别从多个槽延伸到用于装载和卸载基板的室的后端; 以及用于将腔室连接到加工工具的连接框架。 多个隔室通过分隔板彼此分离，并设置有用于加热多个隔室的加热器，并且每个隔间具有气体注入口，用于将热惰性气体吹向放置在其中的基板上。

公开(公告)号：US09640416B2

公开(公告)日：2017-05-02

申请号：US13727324

申请日：2012-12-26

Applicant: ASM IP Holding B.V.

Inventor： Izumi Arai

IPC: C23C16/458 ,  H01L21/67

CPC classification number: H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  Y10S901/30

Abstract: A single- and dual-chamber module-attachable wafer-handling chamber includes: a wafer-handling main chamber equipped with a wafer-handling robot therein, and adaptors for connecting process modules to the wafer-handling main chamber. The adaptors are detachably attached to the sides of the wafer-handling main chamber, respectively, and the process modules are detachably attached to the adaptors, respectively, so that the process modules can be attached to the wafer-handling main chamber, regardless of whether the process modules are of a single-chamber type or dual-chamber type.

公开(公告)号：US09343350B2

公开(公告)日：2016-05-17

申请号：US14244689

申请日：2014-04-03

Applicant: ASM IP Holding B.V.

Inventor： Izumi Arai

IPC: H01L21/687 ,  H01L21/677

CPC classification number: H01L21/68707 ,  H01L21/67742

Abstract: An anti-slip end effector for transporting a workpiece, configured to be attached to a robotic arm, includes: a workpiece-supporting area for placing a workpiece thereon for transportation; and at least one anti-slip protrusion disposed in the workpiece-supporting area for supporting a backside of the workpiece, said anti-slip protrusion having a top face capable of contacting and adhering to the backside of the workpiece by van der Waals force and capable of pivoting on a pivot axis, said pivot axis being disposed away from a center of the top face as viewed from above.

Abstract translation: 一种用于输送工件的防滑端部执行器，构造成附接到机器臂上，包括：用于将工件放置在其上用于运输的工件支撑区域; 以及设置在所述工件支撑区域中用于支撑所述工件的后侧的至少一个防滑突起部，所述防滑突起具有能够通过范德华力接触并粘附到所述工件的背面的顶面，并且能够 在枢转轴线上枢转，所述枢转轴线从上方观察远离所述顶面的中心。

公开(公告)号：US20150287626A1

公开(公告)日：2015-10-08

申请号：US14244689

申请日：2014-04-03

Applicant: ASM IP Holding B.V.

Inventor： Izumi Arai

IPC: H01L21/683 ,  H01L21/677

CPC classification number: H01L21/68707 ,  H01L21/67742

Abstract: An anti-slip end effector for transporting a workpiece, configured to be attached to a robotic arm, includes: a workpiece-supporting area for placing a workpiece thereon for transportation; and at least one anti-slip protrusion disposed in the workpiece-supporting area for supporting a backside of the workpiece, said anti-slip protrusion having a top face capable of contacting and adhering to the backside of the workpiece by van der Waals force and capable of pivoting on a pivot axis, said pivot axis being disposed away from a center of the top face as viewed from above.

Abstract translation: 一种用于输送工件的防滑端部执行器，构造成附接到机器臂上，包括：用于将工件放置在其上用于运输的工件支撑区域; 以及设置在所述工件支撑区域中用于支撑所述工件的后侧的至少一个防滑突起部，所述防滑突起具有能够通过范德华力接触并粘附到所述工件的背面的顶面，并且能够 在枢转轴线上枢转，所述枢转轴线从上方观察远离所述顶面的中心。

公开(公告)号：US10403523B2

公开(公告)日：2019-09-03

申请号：US15211538

申请日：2016-07-15

Applicant: ASM IP Holding B.V.

Inventor： Soo Hyun Kim ,  Dae Youn Kim ,  Izumi Arai

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Provided is a substrate processing apparatus including a load-lock chamber; a transfer chamber connected to the load-lock chamber; and one or more processing chambers connected to the transfer chamber. The transfer chamber includes a transfer arm that transfers a substrate between the load-lock chamber and the one or more processing chambers, the load-lock chamber includes a plurality of load-lock stations for accommodating a plurality of substrates as a matrix of m×n. According to the substrate processing apparatus, a time taken to transfer substrates may be reduced greatly, and productivity may be improved.

公开(公告)号：US10679879B2

公开(公告)日：2020-06-09

申请号：US16516499

申请日：2019-07-19

Applicant: ASM IP Holding B.V.

Inventor： Soo Hyun Kim ,  Dae Youn Kim ,  Izumi Arai

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Provided is a substrate processing apparatus including a load-lock chamber; a transfer chamber connected to the load-lock chamber; and one or more processing chambers connected to the transfer chamber. The transfer chamber includes a transfer arm that transfers a substrate between the load-lock chamber and the one or more processing chambers, the load-lock chamber includes a plurality of load-lock stations for accommodating a plurality of substrates as a matrix of m×n. According to the substrate processing apparatus, a time taken to transfer substrates may be reduced greatly, and productivity may be improved.

公开(公告)号：US20160013084A1

公开(公告)日：2016-01-14

申请号：US14327134

申请日：2014-07-09

Applicant: ASM IP Holding B.V.

Inventor： Keisuke Kamata ,  Hiroyuki Sato ,  Kazunori Furukawahara ,  Masaei Suwada ,  Kenkichi Okubo ,  Izumi Arai

IPC: H01L21/67

CPC classification number: H01L21/67109 ,  F27B17/0025 ,  F27B2009/124 ,  H01L21/67775 ,  H01L21/67778

Abstract: A pre-baking apparatus for heating a substrate upstream of a process tool is adapted to be connected to an EFEM (equipment front end module) and includes: a chamber which has a front face with multiple slots arranged in a height direction of the chamber, and which is divided into multiple compartments extending from the multiple slots, respectively, toward a rear end of the chamber for loading and unloading substrates; and a connecting frame for connecting the chamber to the process tool. The multiple compartments are separated from each other by a divider plate and provided with heaters for heating the multiple compartments, and each compartment has a gas injection port for blowing a hot inert gas over the substrate placed therein toward the slot.

Abstract translation: 用于加热处理工具上游的基板的预烘烤装置适于连接到EFEM（设备前端模块），并且包括：具有在室的高度方向上布置有多个槽的前表面的室， 并且其分成多个隔室，分别从多个槽延伸到用于装载和卸载基板的室的后端; 以及用于将腔室连接到加工工具的连接框架。 多个隔室通过分隔板彼此分离，并设置有用于加热多个隔室的加热器，并且每个隔间具有气体注入口，用于将热惰性气体吹向放置在其中的基板上。

公开(公告)号：US20140174354A1

公开(公告)日：2014-06-26

申请号：US13727324

申请日：2012-12-26

Applicant: ASM IP HOLDING B.V.

Inventor： Izumi Arai

IPC: C23C16/458

CPC classification number: H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  Y10S901/30

Abstract: A single- and dual-chamber module-attachable wafer-handling chamber includes: a wafer-handling main chamber equipped with a wafer-handling robot therein, and adaptors for connecting process modules to the wafer-handling main chamber. The adaptors are detachably attached to the sides of the wafer-handling main chamber, respectively, and the process modules are detachably attached to the adaptors, respectively, so that the process modules can be attached to the wafer-handling main chamber, regardless of whether the process modules are of a single-chamber type or dual-chamber type.

Abstract translation: 单室和双室模块可附接晶片处理室包括：在其中配备有晶片处理机器人的晶片处理主室，以及用于将处理模块连接到晶片处理主室的适配器。 适配器分别可拆卸地附接到晶片处理主室的侧面，并且处理模块分别可拆卸地附接到适配器，使得处理模块可以附接到晶片处理主室，而不管是否 工艺模块是单室型或双腔型。