公开(公告)号：USD1012873S1

公开(公告)日：2024-01-30

申请号：US29752090

申请日：2020-09-24

Applicant: ASM IP Holding B.V.

Designer： JaeHyun Kim ,  JeongHo Lee ,  HyunSoo Jang

Abstract: FIG. 1 is a top perspective view of an electrode for semiconductor processing apparatus showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a cross-sectional view, taken along line 5-5 of FIG. 3;
FIG. 6 is a cross-sectional view, taken along line 6-6 of FIG. 3;
FIG. 7 is an enlarged view of area 7 encircled in FIG. 1;
FIG. 8 is an enlarged view of area 8 encircled in FIG. 2; and,
FIG. 9 is an enlarged view of area 9 encircled in FIG. 3.
The dash-dot-dash broken lines illustrate the bounds of the portions shown enlarged in the drawings and form no part of the claimed design.

公开(公告)号：USD980814S1

公开(公告)日：2023-03-14

申请号：US29782978

申请日：2021-05-11

Applicant: ASM IP Holding B.V.

Designer： JinHo Shin ,  JaeHyun Kim ,  JeongHo Lee ,  HyunSoo Jang

公开(公告)号：US20240363331A1

公开(公告)日：2024-10-31

申请号：US18664118

申请日：2024-05-14

Applicant: ASM IP Holding B.V.

Inventor： DaeYoun Kim ,  JaeHyun Kim ,  SeungHwan Lee

IPC: H01L21/02 ,  C23C16/455 ,  C23C16/458 ,  H01J37/20 ,  H01J37/32

CPC classification number: H01L21/02087 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/4586 ,  H01J37/20 ,  H01J37/3244 ,  H01J37/32715

Abstract: A substrate processing apparatus capable of selective processing a thin film in a bevel edge includes: a substrate support plate including a recess and at least one path formed in the recess; and a gas supply unit on the substrate support plate, wherein a first distance between a portion of the substrate support plate inside the recess and the gas supply unit is less than a second distance between the gas supply unit and the other portion of the substrate support plate outside the recess.

公开(公告)号：USD980813S1

公开(公告)日：2023-03-14

申请号：US29782977

申请日：2021-05-11

Applicant: ASM IP Holding B.V.

Designer： JinHo Shin ,  JaeHyun Kim ,  JeongHo Lee ,  HyunSoo Jang

公开(公告)号：US20210319982A1

公开(公告)日：2021-10-14

申请号：US17224779

申请日：2021-04-07

Applicant: ASM IP Holding B.V.

Inventor： JaeHyun Kim ,  DaeYoun Kim ,  JeongHo Lee ,  HyunSoo Jang ,  YonJong Jeon

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/52

Abstract: A substrate processing apparatus capable of preventing power dissipation and achieving high process reproducibility includes a partition and a processing unit below the partition, wherein the processing unit includes a conductive body and at least one conductive protrusion integrally formed with the conductive body.

公开(公告)号：US20210180188A1

公开(公告)日：2021-06-17

申请号：US17120063

申请日：2020-12-11

Applicant: ASM IP Holding B.V.

Inventor： DaeYoun Kim ,  JaeHyun Kim ,  SeungHwan Lee

IPC: C23C16/458 ,  C23C16/455

Abstract: A substrate processing apparatus capable of selective processing a thin film in a bevel edge includes: a substrate support plate including a recess and at least one path formed in the recess; and a gas supply unit on the substrate support plate, wherein a first distance between a portion of the substrate support plate inside the recess and the gas supply unit is less than a second distance between the gas supply unit and the other portion of the substrate support plate outside the recess.

公开(公告)号：US20210166910A1

公开(公告)日：2021-06-03

申请号：US17103904

申请日：2020-11-24

Applicant: ASM IP Holding B.V.

Inventor： DaeYoun Kim ,  JaeHyun Kim ,  SeungHwan Lee

IPC: H01J37/20 ,  H01J37/32 ,  H01L21/311

Abstract: A substrate processing apparatus capable of selective processing a thin film in a bevel region thereof includes a substrate support plate for supporting a substrate to be processed, the substrate support plate including: an inner portion having an upper surface having an area less than that of the substrate to be processed; and a peripheral portion surrounding the inner portion, wherein an upper surface of the peripheral portion is below the upper surface of the inner portion.

公开(公告)号：USD1023959S1

公开(公告)日：2024-04-23

申请号：US29782976

申请日：2021-05-11

Applicant: ASM IP Holding B.V.

Designer： JeongHo Lee ,  JaeHyun Kim ,  JinHo Shin ,  HyunSoo Jang

Abstract: FIG. 1 is a top perspective view of an electrode for substrate processing apparatus showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a side elevation view thereof; and,
FIG. 6 is a cross-sectional view, taken along a line 6-6 of FIG. 3.

公开(公告)号：USD1005974S1

公开(公告)日：2023-11-28

申请号：US29839254

申请日：2022-05-19

Applicant: ASM IP Holding B.V.

Designer： JinHo Shin ,  JaeHyun Kim ,  JeongHo Lee

Abstract: FIG. 1 is a top perspective view of a gas distributor for semiconductor manufacturing apparatus, showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a front side view thereof;
FIG. 6 is a back side view thereof;
FIG. 7 is a right side view thereof;
FIG. 8 is a left side view thereof; and,
FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 3.

公开(公告)号：USD981973S1

公开(公告)日：2023-03-28

申请号：US29782975

申请日：2021-05-11

Applicant: ASM IP Holding B.V.

Designer： JaeHyun Kim ,  JeongHo Lee ,  JinHo Shin ,  JongSu Kim