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公开(公告)号:US20240124981A1
公开(公告)日:2024-04-18
申请号:US18377885
申请日:2023-10-09
Applicant: ASM IP Holding B.V.
Inventor: Arun Thottappayil , DongRak Jung , JongSu Kim
IPC: C23C16/455
CPC classification number: C23C16/45565
Abstract: A gas inlet tube assembly is presented. The assembly comprising a first inlet configured to insert a first process gas and a second inlet configured to insert a second process gas; a gas inlet tube configured to mix the first process gas from the first inlet and the second process gas from the second inlet, the gas inlet tube being in fluid communication with a reaction chamber of the substrate processing apparatus, comprising upper and lower segments, wherein the first inlet and the second inlet are placed in the upper segment of the gas inlet tube and face with each other directly opposite, the upper segment is converging cone shape, the lower segment is diverging cone shape, the ratio of the length of the upper segment bottom to the length of the lower segment bottom can be 0.1˜0.9, preferably 0.15˜0.25.
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公开(公告)号:US11866823B2
公开(公告)日:2024-01-09
申请号:US17967035
申请日:2022-10-17
Applicant: ASM IP Holding B.V.
Inventor: SeungHwan Lee , HakYong Kwon , JongSu Kim , SungBae Kim , JuHyuk Park
IPC: C23C16/455 , H01J37/32 , H01L21/67 , H01L21/673 , C23C16/458 , H01L21/687
CPC classification number: C23C16/45544 , C23C16/458 , C23C16/45536 , H01J37/3244 , H01J37/32082 , H01J37/32211 , H01L21/673 , H01L21/67017 , H01L21/67103 , H01L21/6875 , H01L21/68735
Abstract: A substrate processing device capable of preventing deformation of a substrate during a process includes a substrate supporting unit having a contact surface that comes into contact with an edge of a substrate to be processed, wherein the substrate supporting unit includes a protruding (e.g. embossed) structure protruding from a base to support deformation from the inside of the edge of the substrate to be processed.
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公开(公告)号:US20230052239A1
公开(公告)日:2023-02-16
申请号:US17967035
申请日:2022-10-17
Applicant: ASM IP Holding B.V.
Inventor: SeungHwan Lee , HakYong Kwon , JongSu Kim , SungBae Kim , JuHyuk Park
IPC: H01L21/687 , H01L21/67 , H01J37/32
Abstract: A substrate processing device capable of preventing deformation of a substrate during a process includes a substrate supporting unit having a contact surface that comes into contact with an edge of a substrate to be processed, wherein the substrate supporting unit includes a protruding (e.g. embossed) structure protruding from a base to support deformation from the inside of the edge of the substrate to be processed.
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公开(公告)号:USD981973S1
公开(公告)日:2023-03-28
申请号:US29782975
申请日:2021-05-11
Applicant: ASM IP Holding B.V.
Designer: JaeHyun Kim , JeongHo Lee , JinHo Shin , JongSu Kim
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公开(公告)号:US11499226B2
公开(公告)日:2022-11-15
申请号:US16671847
申请日:2019-11-01
Applicant: ASM IP Holding B.V.
Inventor: SeungHwan Lee , HakYong Kwon , JongSu Kim , SungBae Kim , JuHyuk Park
IPC: C23C16/455 , H01J37/32 , H01L21/67 , H01L21/673 , C23C16/458
Abstract: A substrate processing device capable of preventing deformation of a substrate during a process includes a substrate supporting unit having a contact surface that comes into contact with an edge of a substrate to be processed, wherein the substrate supporting unit includes a protruding (e.g. embossed) structure protruding from a base to support deformation from the inside of the edge of the substrate to be processed.
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