公开(公告)号：US20230392278A1

公开(公告)日：2023-12-07

申请号：US18235589

申请日：2023-08-18

Applicant: ASM IP Holding B.V.

Inventor： SungBae Kim ,  YongMin Yoo ,  SeungWoo Choi ,  DongSeok Kang ,  JongWon Shon

IPC: C25D11/04 ,  C23C16/44 ,  C25D11/02 ,  H01L21/687 ,  H01L21/67 ,  C23C16/458 ,  C23C16/509 ,  H01J37/32 ,  C23C16/455

CPC classification number: C25D11/04 ,  C23C16/4404 ,  C23C16/4409 ,  C25D11/022 ,  H01L21/68735 ,  H01L21/6719 ,  C23C16/4583 ,  C23C16/5096 ,  H01J37/3244 ,  C23C16/45525 ,  H01J37/32715 ,  H01L21/68757 ,  C23C16/4412 ,  H01J37/32477

Abstract: A substrate supporting plate that provides improved processing uniformity is disclosed. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. A portion of the peripheral portion may include an insulating layer. A central portion of the top surface may not include the insulating layer.