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1.发明公开公开(公告)号：US20230267711A1
公开(公告)日：2023-08-24
申请号：US18015313
申请日：2021-07-29
发明人： Scott Anderson MIDDLEBROOKS , Maxim PISARENCO , Markus Gerardus Martinus Maria VAN KRAAIJ , Coen Adrianus VERSCHUREN
IPC分类号： G06V10/774 , G06N3/0464 , G06V10/50
CPC分类号： G06V10/774 , G06N3/0464 , G06V10/50
摘要： A method and apparatus for selecting patterns from an image such as a design layout. The method includes obtaining an image (e.g., of a target layout) having a plurality of patterns; determining, based on pixel intensities within the image, a metric (e.g., entropy) indicative of an amount of information contained in one or more portions of the image; and selecting, based on the metric, a sub-set of the plurality of patterns from the one or more portions of the image having values of the metric within a specified range. The sub-set of patterns can be provided as training data for training a model associated with a patterning process.
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2.发明申请公开(公告)号：US20220375063A1
公开(公告)日：2022-11-24
申请号：US17761578
申请日：2020-09-14
发明人： Maxim PISARENCO , Scott Anderson MIDDLEBROOKS , Mark John MASLOW , Marie-Claire VAN LARE , Chrysostomos BATISTAKIS
摘要： A system and method for generating predictive images for wafer inspection using machine learning are provided. Some embodiments of the system and method include acquiring the wafer after a photoresist applied to the wafer has been developed; imaging a portion of a segment of the developed wafer; acquiring the wafer after the wafer has been etched; imaging the segment of the etched wafer; training a machine learning model using the imaged portion of the developed wafer and the imaged segment of the etched wafer; and applying the trained machine learning model using the imaged segment of the etched wafer to generate predictive images of a developed wafer. Some embodiments include imaging a segment of the developed wafer; imaging a portion of the segment of the etched wafer; training a machine learning model; and applying the trained machine learning model to generate predictive after-etch images of the developed wafer.
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3.发明申请公开(公告)号：US20190391500A1
公开(公告)日：2019-12-26
申请号：US16486169
申请日：2018-02-07
IPC分类号： G03F7/20 , G01N21/956 , G01N21/95 , G03F7/00
摘要： Methods of measuring variation across multiple instances of a pattern on a substrate or substrates after a step in a device manufacturing process are disclosed. In one arrangement, data representing a set of images is received. Each image represents a different instance of the pattern, wherein the pattern includes a plurality of pattern elements. The set of images are registered relative to each other to superimpose the instances of the pattern. The registration includes applying different weightings to two or more of the plurality of pattern elements, wherein the weightings control the extent to which each pattern element contributes to the registration of the set of images and each weighting is based on an expected variation of the pattern element to which the weighting is applied. Variation in the pattern is measured using the registered set of images.
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公开(公告)号：US20190391498A1
公开(公告)日：2019-12-26
申请号：US16561096
申请日：2019-09-05
发明人： Scott Anderson MIDDLEBROOKS , Markus Gerardus Martinus Maria VAN KRAAIJ , Adrianus Cornelis Matheus KOOPMAN , Stefan HUNSCHE , Willem Marie Julia Marcel COENE
摘要： A method and apparatus of detection, registration and quantification of an image. The method may include obtaining an image of a lithographically created structure, and applying a level set method to an object, representing the structure, of the image to create a mathematical representation of the structure. The method may include obtaining a first dataset representative of a reference image object of a structure at a nominal condition of a parameter, and obtaining second dataset representative of a template image object of the structure at a non-nominal condition of the parameter. The method may further include obtaining a deformation field representative of changes between the first dataset and the second dataset. The deformation field may be generated by transforming the second dataset to project the template image object onto the reference image object. A dependence relationship between the deformation field and change in the parameter may be obtained.
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5.发明申请公开(公告)号：US20130135600A1
公开(公告)日：2013-05-30
申请号：US13667174
申请日：2012-11-02
发明人： Scott Anderson MIDDLEBROOKS , Rene Andreas Maria Pluijms , Martyn John Coogans , Marc Johannes Noot
IPC分类号： G03B27/54
CPC分类号： G03F7/70625 , G03F7/70525 , G03F7/70641
摘要： An inspection method, and corresponding apparatus, enables classification of pupil images according to a process variable. The method comprises acquiring diffraction pupil images of a plurality of structures formed on a substrate during a lithographic process. A process variable of the lithographic process varies between formation of the structures, the variation of the process variable resulting in a variation in the diffraction pupil images. The method further comprises determining at least one discriminant function for the diffraction pupil images, the discriminant function being able to classify the pupil images in terms of the process variable.
摘要翻译： 检查方法和相应的装置能够根据过程变量分类瞳孔图像。 该方法包括在光刻工艺期间获取在基板上形成的多个结构的衍射光瞳图像。 光刻过程的过程变量在结构的形成之间变化，过程变量的变化导致衍射光瞳图像的变化。 该方法还包括确定用于衍射光瞳图像的至少一个判别函数，判别函数能够根据过程变量对瞳孔图像进行分类。
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公开(公告)号：US20240320528A1
公开(公告)日：2024-09-26
申请号：US18579560
申请日：2022-08-17
发明人： Patrick Philipp HELFENSTEIN , Scott Anderson MIDDLEBROOKS , Markus Gerardus Martinus Maria VAN KRAAIJ , Maxim PISARENCO
IPC分类号： G06N7/01
CPC分类号： G06N7/01
摘要： A method of designing a target includes obtaining a model of an initial dataset, performing a Bayesian optimization using the model which provides an improved model, and performing an optimization of the target design using the improved model.
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公开(公告)号：US20240152060A1
公开(公告)日：2024-05-09
申请号：US18282305
申请日：2022-02-17
发明人： Patrick Philipp HELFENSTEIN , Scott Anderson MIDDLEBROOKS , Maxim PISARENCO , Markus Gerardus Martinus Maria VAN KRAAIJ , Alexander Prasetya KONIJNENBERG
IPC分类号： G03F7/00
CPC分类号： G03F7/705 , G03F7/70575 , G03F7/70675
摘要： A method and system for predicting process information (e.g., phase data) using a given input (e.g., intensity) to a parameterized model are described. A latent space of a given input is determined based on dimensional data in a latent space of the parameterized model for a given input to the parameterized model. Further, an optimum latent space is determined by constraining the latent space with prior information (e.g., wavelength) that enables converging to a solution that causes more accurate predictions of the process information. The optimum latent space is used to predict the process information. The given input may be a measured amplitude (e.g., intensity) associated with the complex electric field image. The predicted process information can be complex electric field image having amplitude data and phase data. The parameterized model comprises variational encoder-decoder architecture.
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公开(公告)号：US20210286270A1
公开(公告)日：2021-09-16
申请号：US17334574
申请日：2021-05-28
摘要： Described herein is a method for quantifying uncertainty in parameterized (e.g., machine learning) model predictions. The method comprises causing a parameterized model to predict multiple posterior distributions from the parameterized model for a given input. The multiple posterior distributions comprise a distribution of distributions. The method comprises determining a variability of the predicted multiple posterior distributions for the given input by sampling from the distribution of distributions; and using the determined variability in the predicted multiple posterior distributions to quantify uncertainty in the parameterized model predictions. The parameterized model comprises encoder-decoder architecture. The method comprises using the determined variability in the predicted multiple posterior distributions to adjust the parameterized model to decrease the uncertainty of the parameterized model for predicting wafer geometry, overlay, and/or other information as part of a semiconductor manufacturing process.
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公开(公告)号：US20200320238A1
公开(公告)日：2020-10-08
申请号：US16763376
申请日：2018-11-29
摘要： A method involving obtaining a resist deformation model for simulating a deformation process of a pattern in resist, the resist deformation model being a fluid dynamics model configured to simulate an intrafluid force acting on the resist, performing, using the resist deformation model, a computer simulation of the deformation process to obtain a deformation of the developed resist pattern for an input pattern to the resist deformation model, and producing electronic data representing the deformation of the developed resist pattern for the input pattern.
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10.发明申请公开(公告)号：US20190278188A1
公开(公告)日：2019-09-12
申请号：US16351873
申请日：2019-03-13
发明人： Alexander YPMA , Jasper MENGER , David DECKERS , David HAN , Adrianus Cornelis Matheus KOOPMAN , Irina LYULINA , Scott Anderson MIDDLEBROOKS , Richard Johannes Franciscus VAN HAREN , Jochem Sebastiaan WILDENBERG
摘要： In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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