公开(公告)号：US20190212660A1

公开(公告)日：2019-07-11

申请号：US16331547

申请日：2017-08-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Nitish KUMAR ,  Adrianus Johannes Hendrikus SCHELLEKENS ,  Sietse Thijmen VAN DER POST ,  Ferry ZIJP ,  Willem Maria Julia Marcel COENE ,  Peter Danny VAN VOORST ,  Duygu AKBULUT ,  Sarathi ROY

IPC: G03F7/20

CPC classification number: G03F7/70191 ,  G03F7/70341 ,  G03F7/70516 ,  G03F7/7085 ,  G03F7/70916 ,  G03F7/70941

Abstract: An optical system delivers illuminating radiation and collects radiation after interaction with a target structure on a substrate. A measurement intensity profile is used to calculate a measurement of the property of the structure. The optical system may include a solid immersion lens. In a method, the optical system is controlled to obtain a first intensity profile using a first illumination profile and a second intensity profile using a second illumination profile. The profiles are used to derive a correction for mitigating the effect of, e.g., ghost reflections. Using, e.g., half-moon illumination profiles in different orientations, the method can measure ghost reflections even where a solid immersion lens would cause total internal reflection. The optical system may include a contaminant detection system to control a movement based on received scattered detection radiation. The optical system may include an optical component having a dielectric coating to enhance evanescent wave interaction.

公开(公告)号：US20200257208A1

公开(公告)日：2020-08-13

申请号：US16851477

申请日：2020-04-17

Applicant: ASML Netherlands B.V.

Inventor： Scott Anderson MIDDLEBROOKS ,  Willem Maria Julia Marcel COENE ,  Frank Arnoldus Johannes Maria DRIESSEN ,  Adrianus Cornelis Matheus KOOPMAN ,  Markus Gerardus Martinus Maria VAN KRAAIJ

IPC: G03F7/20 ,  G06N7/00 ,  G06N20/00 ,  G06F30/367

Abstract: A defect prediction method for a device manufacturing process involving production substrates processed by a lithographic apparatus, the method including training a classification model using a training set including measured or determined values of a process parameter associated with the production substrates processed by the device manufacturing process and an indication regarding existence of defects associated with the production substrates processed in the device manufacturing process under the values of the process parameter, and producing an output from the classification model that indicates a prediction of a defect for a substrate.

公开(公告)号：US20160313651A1

公开(公告)日：2016-10-27

申请号：US15104517

申请日：2014-11-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Scott Anderson MIDDLEBROOKS ,  Willem Maria Julia Marcel COENE ,  Frank Arnoldus Johannes Maria DRIESSEN ,  Adrianus Cornelis Matheus KOOPMAN ,  Markus Gerardus Martinus Maria VAN KRAAIJ

IPC: G03F7/20 ,  G06N7/00 ,  G06N99/00 ,  G06F17/50

Abstract: A defect prediction method for a device manufacturing process involving production substrates processed by a lithographic apparatus, the method including training a classification model using a training set including measured or determined values of a process parameter associated with the production substrates processed by the device manufacturing process and an indication regarding existence of defects associated with the production substrates processed in the device manufacturing process under the values of the process parameter, and producing an output from the classification model that indicates a prediction of a defect for a substrate.

Abstract translation: 一种涉及由光刻设备处理的生产基板的装置制造过程的缺陷预测方法，该方法包括使用包括与通过装置制造过程处理的生产基板相关联的处理参数的测量值或确定值的训练集来训练分类模型;以及 关于在处理参数的值下在器件制造过程中处理的生产基板的相关缺陷的存在的指示，以及产生指示预测基板的缺陷的分类模型的输出。