A SUBSTRATE HOLDER AND A METHOD OF MANUFACTURING A SUBSTRATE HOLDER

    公开(公告)号:US20190332015A1

    公开(公告)日:2019-10-31

    申请号:US16315125

    申请日:2017-07-06

    Abstract: There is disclosed a substrate holder, a method of manufacturing a substrate holder, a lithographic apparatus comprising the substrate holder, and a method of manufacturing devices using the lithographic apparatus. In one arrangement, there is provided a substrate holder for use in a lithographic apparatus. The substrate holder supports a substrate. The substrate holder comprises a main body. The main body has a main body surface. A plurality of burls are provided projecting from the main body surface. Each burl has a burl side surface and a distal end surface. The distal end surface of each burl engages with the substrate. The distal end surfaces of the burls substantially conform to a support plane and support the substrate. A layer of carbon based material is provided in a plurality of separated regions of carbon based material. The layer of carbon based material provides a surface with a lower coefficient of friction than a part of the main body surface outside the plurality of separated regions of carbon based material. The layer of carbon based material covers only part of the distal end surface of at least one of the burls. Alternatively, the layer of carbon based material covers the distal end surface and at least a portion of the burl side surface of at least one of the burls.

    BURLS WITH ALTERED SURFACE TOPOGRAPHY FOR HOLDING AN OBJECT IN LITHOGRAPHY APPLICATIONS

    公开(公告)号:US20210202293A1

    公开(公告)日:2021-07-01

    申请号:US16756907

    申请日:2018-10-04

    Abstract: Various burl designs for holding an object in a lithographic apparatus are described. A lithographic apparatus includes an illumination system, a first support structure, a second support structure, and a projection system. The illumination system is designed to receive radiation and to direct the radiation towards a patterning device that forms patterned radiation. The first support structure is designed to support the patterning device on the first support structure. The second support structure has a plurality of burls and is designed to support the substrate on the plurality of burls. A topography of a top surface of each of the plurality of burls is not substantially flat, such that a contact area between the substrate and each of the plurality of burls is reduced. The projection system is designed to receive the patterned radiation and to direct the patterned radiation towards the substrate.

    WAFER CLAMP HARD BURL PRODUCTION AND REFURBISHMENT

    公开(公告)号:US20230031443A1

    公开(公告)日:2023-02-02

    申请号:US17788806

    申请日:2020-12-08

    Abstract: Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).

    SYSTEMS AND METHODS FOR MANUFACTURING A DOUBLE-SIDED ELECTROSTATIC CLAMP

    公开(公告)号:US20230021360A1

    公开(公告)日:2023-01-26

    申请号:US17790341

    申请日:2020-12-04

    Abstract: Systems, apparatuses, and methods are provided for manufacturing an electrostatic clamp. An example method can include forming, during a first duration of time comprising a first time, a top clamp comprising a first set of electrodes and a plurality of burls. The method can further include forming, during a second duration of time comprising a second time that overlaps the first time, a core comprising a plurality of fluid channels configured to carry a thermally conditioned fluid. The method can further include forming, during a third duration of time comprising a third time that overlaps the first time and the second time, a bottom clamp comprising a second set of electrodes. In some aspects, the example method can include manufacturing the electrostatic clamp without an anodic bond.

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