APPARATUS AND METHOD FOR MEASURING SUBSTRATE HEIGHT

    公开(公告)号:US20220244651A1

    公开(公告)日:2022-08-04

    申请号:US17625466

    申请日:2020-06-15

    IPC分类号: G03F9/00 G03F7/20

    摘要: An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.